Toray Industries, Inc.

Ryoji Okuda

Yuki Masuda

Masao Tomikawa

Yu Shoji

Kimio Isobe

Kazuto Miyoshi

Shigeo Fujimori

Seiji Fukuda

Tetsuo Oka

Naoyo Okamoto

Keika Hashimoto

Shigetaka Kasai

Yutaro Koyama

Yohei Kiuchi

Yukari Arimoto

Satoshi Yoshida

Nana Takeuchi

The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200&#xb0; C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like. (In the general formula (1), Rand Reach are a divalent aliphatic group, Rand Reach are a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group bonded to an aromatic group by &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), Rand Reach are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014; or &#x2014;C(CF)&#x2014; (wherein F is fluorine), p and q each are an integer number in the range of 0 to 3).

Di-amine compound, and heat-resistant resin and resin composition using the same

The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250&#xb0; C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

Resin composition

A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

Resin and photosensitive resin composition

The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Cured film and method for producing same

A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

Photosensitive resin composition

Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

Cured film formed by curing photosensitive resin composition and method for manufacturing same

Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device

Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein Rhas an organic group represented by general formula (3) and an organic group represented by general formula (4).

A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle &#x3b1; with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle &#x3b2; with a plane parallel to the polishing surface, the angle &#x3b1; is larger than 90 degrees, the angle &#x3b2; is not smaller than 85 degrees, and the angle &#x3b2; is smaller than the angle &#x3b1;, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3&#xd7;10&#x3bc;m/Pa and not more than 4.4&#xd7;10&#x3bc;m/Pa.

Polishing pad

The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100&#xb0; C. or higher and 140&#xb0; C. or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing.

Photosensitive resin composition and process for producing heat-resistant resin film

Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated and which shows an absorption maximum at a wavelength of not less than 350 nm and not more than 700 nm; and (d) a compound which does not have an absorption maximum at a wavelength of not less than 350 nm to less than 500 nm, and has an absorption maximum at a wavelength of not less than 500 nm and not more than 750 nm. The composition is preferably used for forming light-blocking separators or black matrices of organic electroluminescent devices and liquid crystal display elements.

Positive-type photosensitive resin composition

Positive-working photosensitive resin precursor composition

A display device having a polyimide insulating layer is disclosed. The display device has a first electrode formed on a substrate, the polyimide insulating layer formed on the first electrode in such a way that the first electrode is partially exposed, and a second electrode facing the first electrode, wherein the polyimide insulating layer is a positive-type photosensitive polyimide.

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Otsu, Japan

Ryoji Okuda