Hitachi, Ltd.

Hitachi Metals, Ltd.

Hitachi Media Electronics Co., Ltd.

Ryoji Okada

Mitsuaki Haneda

Toshihiro Yamada

Atsushi Kazama

Kunio Takada

Masayuki Yamada

Takanori Aono

Takeshi Araya

Kenji Otani

Susumu Hioki

Kooji Aizawa

Katsuhiko Kimura

Yasuhiro Yoshimura

Yoshishige Endo

Naoki Matsushima

Masatoshi Kanamaru

Katsutoshi Nii

Motohiro Sato

Takashi Yamaguchi

Shohei Hata

Seiichi Katou

Hideaki Amano

Kazuyuki Fukuda

Hiromu Hirai

Toshio Sugiyama

Toshiaki Makino

Satoru Yamaura

Tadaaki Ishikawa

Yuichi Koizumi

Hideyuki Kimura

Marutomo Goto

Masakatsu Saitoh

Yoshiro Ibaraki

Teruhisa Akashi

Hideo Suenaga

Eiji Sakamoto

Takashi Kono

Keiji Taguchi

Akio Takatsuka

Toshio Matsushita

Seiji Katayama

Heikichi Kuwabara

Toshiki Kida

Yoshiaki Takada

Kazuo Niikura

Akira Matsunawa

Hiromitsu Imamiya

Kooju Aizawa

Kiyohito Tani

Tetsurou Kawai

An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.

Acceleration sensor

A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.

Semiconductor strain sensor

Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Semiconductor sensor device and method for manufacturing same

A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

Functional device package with metallization arrangement for improved bondability of two substrates

An optical device wherein an optical component and a plurality of light emitting elements are mounted on an identical substrate, a level of a surface on which the optical component is mounted is different from that of a surface on which the light emitting elements are mounted by a step provided on the substrate, at least one plane vertical to the surface on which the optical component is mounted and located on a periphery of the substrate is opened, a reflecting surface, a transmitting surface or a diffraction grating surface of the optical component is provided along sides generated by the step provided in the substrate, optical axes of the plurality of light emitting elements of which polarization axes are in parallel with each other intersect with each other on the surface, and an exit light beam of the light emitting elements is emitted from the opened plane.

Optical device, optical pickup and optical disk apparatus

An optical switch for switching communication light beams propagating through a plurality of optical fibers. The switch includes a plurality of input-side lenses, a plurality of moving mirrors, a plurality of output-side lenses, light emitting units, and light receiving units arranged for optical communication. The plurality of input-side lenses include first input-side lenses to which communication light beams coming from first external units and propagating through input-side optical fibers connect optically and second input-side lenses to which the light beams from the light emitting units connect optically. The plurality of output-side lenses include first output-side lenses for causing light beams passing therethrough to optically connect to second output-side optical fibers adapted to propagate the communication light beams to second external units and second output-side lenses for causing the light beams coming from the light emitting units and passing therethrough to optically connect to the light receiving units.

Optical switch and a control method thereof

A water machinery runner, which is highly reliable and is so excellent in wear and corrosion resistances that it can be used even under conditions where sediment is contained in a fluid includes crown 21, band 22 and blade 23 of a water machinery runner 2 to be rotated by a working fluid or a fluid flowing in a passage. The elements of the machinery runner are coated on at least portions of their individual surfaces with a first surface film containing a metal, as selected from the group consisting of Ni, Cr and Co, and a chromium carbide, and a second surface film containing a metal, as selected from the group consisting of Ni, Cr and Co, and a tungsten carbide.

Runner, water wheel and method of manufacturing the same

Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit. The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.

Bearing unit, drainage pump and hydraulic turbine each incorporating the

Drainage pump and a hydraulic turbine incorporating a bearing member,

Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit. The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC - 12% sintered article is attained.

A magnetic disk unit comprising a one-piece carriage structure having a small thermal off-tracking amount, with the carriage structure including a rotary shaft; guide arms integrally supported on a guide-arm retainer at their proximal ends and extending independently and parallely; bearing retainers formed on both ends of the guide-arm retainer; and bearings fixed on the bearing retainers rotatably connecting the guide-arm retainer to the rotary shaft. A center line in a direction of thickness of the outermost guide arm is located outside of that of the bearing in a direction of height thereof, and a concave portion is continuously formed on the bearing retainer. Thermal coefficients of expansion of the guide arms and the guide-arm retainer are substantially equal, with the carriage structure being fashioned of an alloy mainly containing Al and Si, eutectic crystal Si particles in the guide arm and/or the guide-arm retainer. The average value of the longest eutectic crystal Si particles therein is 1.6 .mu.m or less or the number of the eutectic crystal Si particles if 5.0 or more per 100 .mu.m.sup.2. In the carriage of manufacturing the carriage of the carriage structure is heated for five to fifteen hours at a temperature of 300.degree. to 500.degree. C. after die casting.

Magnetic disk unit and manufacturing method of carriage structure thereof

A vertical shaft type pump including a bearing device in which water in the pump is utilized as lubricating water without supplying water to the bearing from the outside of the pump, thereby repeatedly conducting no-load operation in the air (in such a state that water is not pumped) stably for a long period of time. In the pump, a water storage tank upwardly opened is fixed to a rotary shaft, and the lubricating water (the water in the pump) is retained within the water storage tank so that the bearing is operated while being always soaked in the lubricating water. Also, foreign substances in the water storage tank are mixed with the water without deposition, and the water containing the foreign substances is replaced by the newly pumped water.

Vertical shaft type pump

A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers of the heat transfer unit permit liquid to pass through the heat transfer unit so as to conduct heat. A semiconductor element (IC chip) is mounted on the mounting sheet, and to a base. The resulting assembly is immersed in a liquid. Preferably, the planes of the mesh layers are generally perpendicular to the mounting sheet and the semiconductor element and the material of the mounting sheet chosen to have a thermal expansion coefficient between that of the semiconductor element and the heat transfer unit to reduce thermal stresses. The wires of the mesh layers are preferably of copper as this is inexpensive and provides satisfactory heat conduction.

Heat transfer member

The process for forming an ultrafine-particle film according to this invention is characterized by irradiating the surface of a target of a raw material with laser energy in a predetermined atmosphere under conditions where a plume is generated, exposing a substrate (a base material) directly to the plume generated, and thereby forming a film. The substrate is positioned in the plume at a distance, from the surface of the target of the raw material, of at least the mean free path of atoms and/or molecules of the raw material (or components thereof). By so positioning the substrate, ultrafine particles of the raw material are deposited on the substrate. The plume containing a large amount of ultrafine particles moves at a high speed; and exposure of the substrate, at the specified position relative to the target, to the plume causes strong adhesion of ultrafine particles contained in the plume to the substrate, resulting in formation of a film.

Laser deposition process for forming an ultrafine-particle film

A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.

Sintering method

Growing community of inventors

Ibaraki, Japan

Ryoji Okada