Mitsubishi Electric Corporation

Ryoji Murai

Takaaki Shirasawa

Takahiko Murakami

Korehide Okamoto

Katsuji Ando

Shoji Saito

Shintaro Araki

Mitsunori Aiko

Arata Iizuka

Yuki Hata

Natsuki Tsuji

Takatoshi Yasui

Naohiro Oogushi

A semiconductor chip () having flexibility is bonded to a heat radiation material () with solder. The semiconductor chip () is pressed by a tip of a pressing member () from an upper side. As a result, convex warpage of the semiconductor chip () can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (), the heat radiation of the semiconductor device can be enhanced.

Semiconductor device

An object of the present invention is to provide a semiconductor device capable of reducing external stress transmitted to a semiconductor chip through a lead frame. A semiconductor device includes a base plate, a semiconductor element held on the base plate, a housing disposed on the base plate and having a frame shape enclosing the semiconductor element, a terminal section provided in an outer surface of the housing and connectable to an external device, a lead frame that is long and has one end disposed so as to be connectable to the terminal section provided in the housing and another end connected onto the semiconductor element via a bonding material, a sealing material disposed in the housing to seal the lead frame and the semiconductor element, and a fixing section that fixes, in the housing, part of the lead frame to the base plate or the housing.

Semiconductor device, control device, and method for manufacturing semiconductor device

A cooler () has a cooling plate (), a cooling fin () provided on a center portion of a lower surface of the cooling plate (), and a lower projection () provided on a peripheral portion of the lower surface of the cooling plate (). A semiconductor device () is provided on an upper surface of the cooling plate (). A bus bar () is connected to the semiconductor device (). A cooling mechanism () encloses a lower surface and a lateral surface of the cooler (). An O-ring () is provided between a lower surface of the lower projection () and a bottom surface of the cooling mechanism (). A bolt () penetrates a sidewall of the cooling mechanism () and screws the cooler () to the cooling mechanism ().

Semiconductor package

A technique disclosed in the Description relates to a technique for improving the heat dissipation capability of a semiconductor element and the heat dissipation capability of a lead electrode without increasing the size of a product. A semiconductor device of the technique includes the following: a semiconductor element; a lead electrode having a lower surface connected to an upper surface of the semiconductor element at one end of the lead electrode, the lead electrode being an external terminal; a cooling mechanism disposed on a lower surface side of the semiconductor element; and a heat dissipation mechanism provided to be thermally joined between the lower surface of the lead electrode and the cooling mechanism, the lower surface being more adjacent to an other-end side of the lead electrode than the one end, the heat dissipation mechanism including at least one insulating layer.

The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

Mold device

According to the present invention, a grease layer having a grease as a constituent material is provided in a filling region lying between a heat dissipation surface that is a bottom surface of a heat dissipation material of a semiconductor module and a surface of a cooler. Further, a seal material is formed on the surface of the cooler and covers the entire side surface region of the grease layer without any gap. The seal material has a liquid curable sealing agent as a constituent material.

Growing community of inventors

Fukuoka, Japan

Ryoji Murai