Fujitsu Corporation

Ryoji Matsuyama

Masayuki Kitajima

Toru Okada

Masahiro Nishi

Masanao Fujii

Koji Hashizume

Hidehiko Kobayashi

Yutaka Noda

Tadaaki Shono

Hisao Tanaka

Toshikatsu Shimura

The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding memberincluding a holding wallair-tightly closing a space S that holds a plurality of balls B having the same size and in which a holelarger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup meansfor blowing the balls B held in the holding memberupward; and capturing meansfor capturing a ball B blown up by the blowup meansand reached the hole.

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn&#x2014;Al alloy. Heat is then applied to the conductor and the wiring. A chemical reaction is accelerated between the conductor and the wiring based on the heat treatment. This allows oxygen to get released out of the conductor and the wiring. Deoxidation is thus realized on the joint surfaces of the conductor and the wiring. Electric resistance is decreased. Electric conduction can thus be established between the conductor and the wiring.

Method of making zinc-aluminum alloy connection

A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

Zinc-aluminum solder alloy

A work conveying and transferring apparatus has a trolley having a casing defining a hermetically sealed space, and a support portion provided on the trolley for placing at least one container containing a cassette carrying works. A container opening device is provided on the trolley to open the container placed on the support portion, and a cassette transferring device is provided for transferring the cassette from the trolley to a treating apparatus, with the container placed on the support portion opened. The support portion is provided in the sealed space, and works can be double sealed by the sealed space and the container.

Double-sealed work conveying and transferring apparatus and container inspecting method

Growing community of inventors

Kawasaki, Japan

Ryoji Matsuyama