Canon Kabushiki Kaisha

Ryoji Kanri

Masahiko Kubota

Atsunori Terasaki

Yoshiyuki Fukumoto

Tamaki Sato

Akihiko Okano

Atsushi Hiramoto

Takumi Suzuki

Kazuhiro Asai

Maki Hatta

Masataka Kato

Masafumi Morisue

Hiroe Ishikura

Shoji Shiba

Masataka Sakurai

Naozumi Nabeshima

Toru Yamane

Toshiyasu Sakai

Makoto Terui

Tetsushi Ishikawa

Etsuko Hino

Yoshiyuki Nakagawa

Teruo Ozaki

Hirokazu Komuro

Ken Tsuchii

Shuji Koyama

Kousuke Kubo

Yoshikazu Saito

Masaya Uyama

Akiko Saito

Kazuaki Shibata

Hiroshi Higuchi

Kazuhiro Hayakawa

Shinji Kishikawa

Atsushi Teranishi

Yasuaki Tominaga

Takayuki Kamimura

Yoshinao Ogata

Hirono Yoneyama

Takumi Shimoda

A method for manufacturing a liquid discharge head comprising: a substrate, a protective layer covering at least a part of the substrate, and a laminate member formed on the protective layer, wherein the method comprises steps of: forming the protective layer on at least a part of the substrate; forming the laminate member on the protective layer with a part of the protective layer exposed, the protective layer comprises at least Si and C, a content of oxygen in a bulk of the protective layer is less than 20 atomic % in terms of an element composition ratio, a modified layer with a content of oxygen of 20 atomic % or more in terms of an element composition ratio is present on a surface of the protective layer, and a thickness of the modified layer between the protective layer and the laminate member is 3.40 nm or less.

Method for manufacturing liquid discharge head and liquid discharge head

A bonded wafer includes: a first wafer having a first surface and a second surface opposite to the first surface, and including a functional element on the first surface; and a second wafer in which a structure having at least one of a hole, a groove and a cavity is formed; wherein an annular protrusion is formed to have a shape to extend along an outer periphery on the second surface of the first wafer; wherein at least a portion of the second wafer is a reduced-diameter portion having a diameter smaller than an inner diameter of the annular protrusion; and wherein, under a state in which the reduced-diameter portion is fitted into a region surrounded by the annular protrusion of the first wafer, the second wafer is bonded to the second surface at least at the region.

Bonded wafer, a method of manufacturing the same, and a method of forming through hole

A method for manufacturing a laminate has a process of forming a film on a substrate by an atomic layer deposition method and a process of forming a layer containing a compound polymerizable with acid and an acid generator, and then curing the layer to form resin layer on the film, in which the nitrogen atom atomic composition ratio of the film is 2.5% or less.

Method for manufacturing laminate and method for manufacturing liquid discharge head

A method for manufacturing a bonded substrate body in which an end portion of an adhesive is located at a position retreated in a direction to the inside of the bonded substrate body from an end surface of a bonding region of a first substrate and a second substrate includes forming a film on the end portion of the adhesive.

Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head

A liquid ejection head includes: a substrate including an energy-generating element; a flow path forming member including a discharge port and having a liquid flow path formed between the flow path forming member and the substrate; and a plurality of through-passages passing through the substrate, each of the through-passages including a first through-passage part serving as a common liquid chamber and a plurality of second through-passage parts communicating with the first through-passage part, wherein a separation wall separating the adjacent first through-passage parts includes a plate-shaped member separating the adjacent first through-passage parts and approximately vertical to a substrate in-plane direction and, at least one protrusion protruding from the plate-shaped member in the substrate in-plane direction and contacting a bottom portion of the first through-passage part.

Liquid ejection head

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

Liquid discharge head, manufacturing method therefor, and recording method

A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

Method for manufacturing structure

There is provided a method for selectively removing a plurality of target objects by using a stripping solution without causing damage to an underlying material, the target objects including a resist used as a mask material for dry etching and a transformed layer and a deposited film formed during the dry etching, the stripping solution including a first composition, a second composition, and a third composition, and the method including continuously changing the composition of the stripping solution from the first composition to the second composition and then from the second composition to the third composition.

Method for removing target object

There are provided a processing method of a substrate in which in forming a trench on the substrate by etching, a side wall surrounding the trench is surely protected, and a manufacturing method of a liquid ejection head. The methods include: repeating sequentially a plurality of cycles of a trench forming step of forming the trench on a printing element substrate, a first protection layer forming step of forming a passivation layer, and a first protection layer removing step of removing a portion at which the trench is excavated in the passivation layer. A second protection layer forming step and a second protection layer removing step are performed between the trench forming step through the first protection layer removing step repeated in a plurality of cycles and the trench forming step through the first protection layer removing step repeated next.

Processing method of substrate and manufacturing method of liquid ejection head

An object of the present invention is to provide a processing method of a silicon substrate, capable of suppressing breakage of thin silicon or a thin film structure of an intermediate layer in etching first and second silicon substrates. According to the present invention, a first silicon substrate and a second silicon substrate are bonded to each other while holding an intermediate layer having an opening between both of the silicon substrates in a bonding step. A closed space defined by at least one of the first and second silicon substrates and the opening at least partly embedded with a filler in a filling step. Furthermore, a liquid supply port is formed in such a manner as to penetrate the filler in the opening and the second silicon substrate from the first silicon substrate in an etching step.

Processing method of silicon substrate, fabricating method of substrate for liquid ejection head, and fabricating method of liquid ejection head

This invention relates to a manufacturing method of a liquid discharge head comprising: forming an active energy ray-curable resin layer on a surface of a substrate on which discharge energy generating elements are formed, attaching a material permeable to active energy rays onto a surface of the active energy ray-curable resin layer, pressing against the material permeable to active energy rays, a master mold being transparent to the active energy rays and having protrusions corresponding to a pattern of discharge ports so as to transfer the protrusions to the material permeable to active energy rays, selectively irradiating the active energy ray-curable resin layer with active energy rays according to a pattern of liquid flow paths so as to cure the active energy ray-curable resin layer, removing the master mold, and removing uncured portions of the active energy ray-curable resin layer.

Manufacturing method of liquid discharge head

A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.

Liquid ejecting head and method for producing the same

A method of manufacturing a liquid ejection head includes the steps of (1) forming a recess in a second surface of a substrate to form a common supply port, (2) forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and (3) performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other.

Liquid ejection head and method of manufacturing same

A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.

Processing method of silicon substrate and liquid ejection head manufacturing method

A liquid discharge head includes a substrate having an energy generating element configured to generate energy required to discharge liquid, a discharge port configured to discharge the liquid and provided in an opposed relationship to the energy generating element, a wall member defining a chamber adapted to store the energy required to discharge liquid the energy being generated by the energy generating element, a discharge portion defining a fluid path connecting the chamber and the discharge port, a supply path facilitating supplying the liquid into the chamber, and a pair of hollow portions provided in the wall member, wherein the hollow portions oppose each other and sandwich at least the entire discharge port in a direction from the discharge port to the substrate, and the hollow portions are independent of the chamber.

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Zushi, Japan

Ryoji Kanri