Hitachi, Ltd.

Hitachi Displays, Ltd.

Ryoji Iwamura

Masateru Morimoto

Hirotaka Imayama

Kazufumi Watabe

Hiromu Terao

Yoshihide Yamaguchi

Hiroshi Hasegawa

Hisashi Sugiyama

Naoya Kitamura

Hideyasu Murooka

Makio Watanabe

Masayuki Kyoui

Ken'ichi Okada

Masahiro Takagi

A liquid crystal display device includes an orientation film on a liquid-crystal-side surface of at least one substrate out of respective substrates which are arranged to face each other with liquid crystal therebetween. The orientation film forms a pattern which is constituted of either a plurality of notches or holes which are spaced from one another on an edge of the orientation film which is beyond a periphery of a display region, and the pattern is formed along an entirety of the edge of the orientation film. The edge of the orientation film is formed along a periphery of the substrate.

Display device and manufacturing method thereof

A display device includes an organic film with a pattern in which forming portions and non-forming portions are present in a mixed form in the periphery thereof, and the pattern is formed around the periphery of the organic film.

A multilayer wiring board fabricating method and a multilayer wiring board fabricated with use of the method that a solvent-free fluid polymer precursor is put on a wiring layer of a base substrate, and space among the wirings is exhausted and is filled with the precursor, and the precursor is hardened under a hydrostatic pressure and then the next wiring layer is formed before the above process is repeated one or more times. The multilayer wiring board fabricating method is excellent in the mass productivity and low cost and in that the wiring can be made highly dense with the substrate having vertical via conductors for connection among the conductor layers.

Multilayer wiring board fabricating method

An apparatus for producing a multilayer ceramic board having uniform density over the total area of the green sheets after a thermal compression bonding comprises a lower mold in which a plurality of green sheets, having conductive wiring patterns printed thereon, are to be set in a stacked state, an upper mold which comes into contact with a top surface of the uppermost sheet of the plurality of green sheets and applies a pressing load on the stacked green sheets toward the lower mold, and a restraining mold which restraining the plurality of green sheets in the stacked state therein and having an inner wall surface in contact with peripheral wall portions of the upper and lower molds, the confining mold being movably supported in a direction of the pressing load of the upper mold.

Method of and apparatus for producing multilayer ceramic board

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Yokohama, Japan

Ryoji Iwamura