Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electronics Corporation

Ryoji Inutsuka

Kunio Ohe

Yoshiyuki Nagai

Hideo Sakon

Kenji Takahashi

Tomoyuki Nakano

Masahiro Sato

Kazuhiko Yamashita

Mamoru Watanabe

Tomoko Fukunaka

Masashi Ishiguro

Koichi Yabuki

Toshikazu Yoneda

Satoshi Shida

Takashi Shimizu

Shinji Kanayama

Kazuhiro Murata

Koji Hirotani

Wataru Hirai

Hiroyuki Yoshida

Yukiharu Ito

Hiroshi Yamauchi

Takio Okamoto

Muneyoshi Fujiwara

Yasuo Izumi

Motohiro Higuchi

Syoji Sato

Hiroaki Hayashi

Keiji Hanada

Yuichi Takakura

Kunio Oe

Naomi Nishi

An object of the present invention is to provide a component a mounting apparatus capable of accurately determining minute mounting applied pressure. The component mounting head of the component mounting apparatus includes: a movable part having a suction bit section and a movable shaft, a weight compensation mechanism for engaging with the movable shaft to compensate for the gravitational force of the total weight of the movable part and a component suctioned to the suction bit section, on the basis of the total weight; a force determination unit for determining a force applied to the movable part in the vertical direction; and a drive unit for moving the force determination unit in the vertical direction. The control unit of the component mounting apparatus controls the drive unit in such a manner that the determination value of the force determination unit becomes a target value.

Component mounting apparatus, component mounting head, and component mounting method

An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Optical processing apparatus

An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.

The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D to D ) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.

Method and apparatus for handling arrayed part

A pusher has a leaf spring , a driving section , a direction changing section , and guides . The driving section nips the leaf spring to longitudinally advance and retract it. Advancement of a fore end of the leaf spring in a pushing direction causes the object facing the leaf spring to be pushed from a first position to a second position. A direction changing section bends the tail end of the leaf spring relative to the fore end so as to change the direction of advancement and retraction. Guides guide the fore and tail ends with respect to the direction changing section.

Pusher, puller loader, unloader, and working device

A method and device for feeding an electronic component are provided by which extensive shutdown of the electronic component mounting device due to lack of components is prevented, thereby enhancing the operation rate. The device has a feeder section designating unit ( ) for designating a desired one of feeder sections ( ), and a feeder section controller ( ) for forcibly moving the feeder section which is currently feeding electronic components to a retracted position when the other feeder section has been designated by the feeder section designating unit ( ) and for moving the designated feeder section which has been in a standby state to a predetermined component feeding position, by which a long-time pause of the electronic component mounting device caused by exhaustion of components is prevented and the operation rate is enhanced.

Method and device for supplying electronic parts

An electronic parts mounting apparatus for divisionally recognizing an electronic part ( ) even when the apparatus is arranged in such that the relative positional relation between a recognition camera ( ) and a nozzle ( ) cannot be varied. The electronic part ( ) is vacuum-clamped by a nozzle ( ), the posture of the nozzle ( ) or the posture of the electronic part ( ) is changed a plurality of times by a rotary driving member ( ), and a part of the electronic part ( ) imaged by the recognition camera ( ) every time the posture of the electronic part ( ) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part ( ) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

Electronic parts mounting apparatus

It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening provided in the nozzle tip end for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end by a specified amount, and the rotation amount of the nozzle tip end and the positioning position of the part supply portion are controlled.

Electronic part mounting machine

The present invention concerns a method and apparatus of automatically mounting electronic components at predetermined positions of an electronic circuit board, which comprise a mounting process of taking out an electronic component,from an electronic components holding unit,and mounting onto an electronic circuit board,and a processing process to trim the electronic component,during the mounting process to a preferable characteristic value thereby allowing to reduce the number of types of electronic components,to be stored in the electronic components holding unit,and reduce the equipment cost and the management cost of the electronic components

Method and device for mounting electronic components

The invention provides an electronic parts mounting machine and an electronic parts packaging method wherein even when a system does not include driving means, such as an XY robot, for driving a mounting head, there is no possibility of causing a decrease in measurement accuracy or a need to allocate a larger space for the installation and movement of a test unit of a lead misalignment tester. When a lead misalignment test is conducted on each lead of an electronic part, a suction nozzle is rotated and, at the same time, the test unit is moved such that the test point of the test unit scans each lead of the electronic part sucked by the suction nozzle while said test point crosses said lead.

Connector manufacturing method

An electronic component mounting apparatus is provided with a plurality of support blocks for supporting boards. A support block is automatically selected from among the plurality of support blocks and exchanged in accordance with the switching of the kind of boards to be supported by the support block, so that the time required for switching the kind of boards is reduced, thereby improving the productivity.

Electronic component mounting apparatus for exchanging support blocks which support circuit boards

Method and apparatus for mounting electronic part

Method and apparatus for mounting electronic component

Electronic component mounting method of exchanging support blocks which

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Osaka, Japan

Ryoji Inutsuka