Hitachi Chemical Company, Ltd.

Ryoji Furutani

Takayuki Matsuzaki

Teiichi Inada

Michio Mashino

Tatsuya Sakuta

Shinya Katou

Kouji Komorida

Rie Katou

Michio Uruno

Maiko Tanaka

Shogo Sobue

Takahiro Tokuyasu

Yasuyuki Ooyama

Yushi Yamaguchi

Takuji Ikeya

Tomohito Yuasa

The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25&#xb0; C. of 3 MPa or less and an elastic modulus at 25&#xb0; C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cmor more.

Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection

A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base materialand an adhesive layerprovided on the peeling base materialin the form of an island, the method including a peeling step of, after laminating a long adhesive layeron the peeling base material, peeling off an unnecessary portionof the adhesive layerso that a predetermined portion of the adhesive layer is left on the peeling base materialin the form of an island, wherein, in the peeling step, the width W of a narrow portion, which is the narrowest in width in a short direction of the unnecessary portionof the adhesive layer, is adjusted so that the breaking strength in the narrow portionis 200 g or more.

Adhesive sheet and method for manufacturing adhesive sheets

A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm.

Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method

An adhesive sheet comprising a release substrate, a substrate film, and a first tacky-adhesive layerplaced between the release substrateand the substrate film, wherein an annular incision D is formed on the release substratefrom the surface of the first tacky-adhesive layerside, the first tacky-adhesive layeris laminated so as to cover the whole inner surface of the incision D in the release substrate, and the incision D has a depth d of less than the thickness of the release substrateand 25 &#x3bc;m or less.

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Growing community of inventors

Ichihara, Japan

Ryoji Furutani