Nippon Mektron Limited

Ryoichi Toyoshima

Masayuki Iwase

Keizo Toyama

Hirokazu Ohdate

Kazuyuki Ozaki

Taisuke Kimura

Akio Yoshida

Mitsunori Sasaki

Hiroyasu Hasegawa

A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.

Catheter flexible printed wiring board and method for manufacturing the same

This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.

Pressure sensor capable of suppressing dispersion in the initial load of pressure

Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element () has an electro-conductive pressure sensing film (), a sensor electrode () provided at a position faced to the pressure sensing film (), and an insulating layer () which creates a predetermined distance 'A' between the pressure sensing film () and the sensor electrode () so as to keep them apart from each other, the pressure sensing film () being a resin film containing carbon particles (); and, a pressure sensor () has the pressure sensing element (), and a detection unit () which is electrically connected with the pressure sensing element () so as to detect contact resistance between the pressure sensing film () and the sensor electrode ().

Pressure sensing element and pressure sensor

[Problem to be Solved] A multilayer flexible printed circuit board having a strip line advantageous to folding is provided. [Solution] A multilayer flexible printed circuit boardof an embodiment is a multilayer flexible printed circuit board having a strip line foldable at a folding part F, the board including: a flexible insulative substrate; an inner layer circuit patternprovided inside the flexible insulative substrateand including a signal lineextending in a predetermined direction; a ground thin filmconstituting a ground layer at least in the folding part Fout of a ground layer of the strip line and constituted of a nonelectrolytic plating coatformed on the flexible insulative substrate; and a protective layerthat covers the ground thin filmand is in close contact with an exposed partfrom which the flexible insulative substrateis exposed.

Method of manufacturing a multilayer flexible printed circuit board

A pressure sensing element () includes a support substrate (); a sensor electrode () supported by the support substrate (); a pressure sensing film () functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (); and an insulating layer () which keeps the sensor electrode () and the pressure sensing film () apart from each other by a predetermined distance A, and has formed therein an opening () in which the sensor electrode () is exposed to the pressure sensing film (), the insulating layer () having an aperture wall () which partitions the opening (), and an aperture end (top aperture end ()) faced to the pressure sensing film (), and the insulating layer () being increased in height, measured from the support substrate (), continuously towards the opening ().

Pressure sensing element having an insulating layer with an increased height from the substrate towards the opening

A microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors located across an insulating layer from the signal lines, characterized in that wiring pitch of the grounding conductors is 1/n of width of the signal lines (where n is a natural number of 1 or 2).

Growing community of inventors

Tokyo, Japan

Ryoichi Toyoshima