Toyoda Gosei Co., Ltd.

Sumita Optical Glass, Inc.

Hitachi Kyowa Engineering Co., Ltd.

Ryoichi Tohmon

Yoshinobu Suehiro

Satoshi Wada

Hideaki Kato

Naruhito Sawanobori

Koichi Ota

Yoshinori Yamamoto

Hiroki Watanabe

Kazuya Aida

Mitsuhiro Inoue

Kunihiro Hadame

Masaaki Ohtsuka

Kenji Mori

Hideaki Takemori

Minoru Hirose

Satoshi Higashiyama

Hiroaki Kawaguchi

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Solid element device and method for manufacturing the same

A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO&#x2014;NbO-based, BO&#x2014;F-based, PO&#x2014;F-based, PO&#x2014;ZnO-based, SiO&#x2014;BO&#x2014;LaO-based, and SiO&#x2014;BO-based low melting glasses.

A method for manufacturing a solid element device, which comprises providing a glass-containing AlOsubstrate () having a GaN based LED element () placed thereon, setting a PO&#x2014;ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415&#xb0; C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 10poise, and is adhered via an oxide formed on the surface of the glass-containing AlOsubstrate (). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.

Submount for light emitting diode and its manufacturing method

A light emitting device has a light emitting element portion that radiates light with a predetermined wavelength, and a wavelength conversion portion that surrounds a phosphor to be excited by the light with the predetermined wavelength with a transparent and non-moisture permeability material in the form of laminae. Further, a light emitting device has a plurality of LED elements disposed on a same plane, and a wavelength conversion portion that comprises a flat transparent base member that is disposed opposite to the plurality of LED elements and a phosphor layer that is of a phosphor to be excited by light emitted from the LED element and is formed like a film on the base member. The phosphor layer includes part with no phosphor in plane.

Light emitting device with wavelength converted by phosphor

A light emitting device has: a light emitting element; a lead that is electrically connected to the light emitting element at its one end and serves as a terminal to supply a power source to the light emitting element; a metal base that the light emitting element is mounted thereon and radiates heat of the light emitting element; and a sealing member that is of transparent resin or glass and covers the light emitting element. The lead is secured to the metal base by a heat-resisting insulating member with a thermal expansion coefficient nearly equal to that of the metal base.

Light emitting device provided with a submount assembly for improved thermal dissipation

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Aichi-ken, Japan

Ryoichi Tohmon