Ube Industries, Inc.

Ryoichi Takasawa

Masahiro Naiki

Tetsuji Hirano

Masayuki Kinouchi

Shuichi Maeda

Kenji Hirotsu

Yasuhiro Kawachi

Yukinori Kohama

Yoshiyuki Watanabe

Masahiko Watanabe

Keiji Iwamoto

Takuya Oka

Miharu Nakagawa

Kosuke Fujiyama

The present invention relates to a polyimide precursor comprising a repeating unit represented by the following chemical formula (1): wherein A is a tetravalent group having at least one aliphatic six membered ring and no aromatic ring in the chemical structure, and B is a divalent group having at least one amide bond and an aromatic ring in the chemical structure; or A is an aliphatic tetravalent group and B is a divalent group having at least one chemical structure represented by the following chemical formula (2) in the chemical structure: and Xand Xare each independently hydrogen, a Calkyl group or a Calkylsilyl group.

Polyimide precursor and polyimide

The phosphorus-containing polycarbonate polyol disclosed herein has a structural unit (I) represented by a formula: &#x2014;OCOO&#x2014; and a structural unit (II) represented by a residue A, wherein A denotes a n-valent residue in which n of alcoholic hydroxyl groups are removed from a phosphorus compound having at least n of alcoholic hydroxyl groups, in which n is an integer of 2 or larger, and wherein a terminal group of the polyol is a alcoholic hydroxyl group. The novel phosphorus-containing polycarbonate polyol, as a reactive flame-retardant agent, can provide flame-retardant properties easily to polyurethane or the like.

Phosphorus-containing polycarbonate polyol, method for production thereof, and phosphorus-containing polycarbonate polyurethane

A curable polyimide resin composition containing a polyimide resin obtainable from by a reaction of a reaction mixture containing a diisocyanate compound, a carbonate group-containing diol compound and an imide compound having two terminal hydroxyhydrocarbyl groups gives a cured insulation film having improved characteristics.

Polyimide resin and curable resin composition

A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.

Modified polyimide resin and curable resin composition

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Ube, Japan

Ryoichi Takasawa