Kobe Steel, Ltd.

Kabushiki Kaisha Kobe Seiko Sho

Ryoichi Ozaki

Yosuke Miwa

Yasuhiro Aruga

Yasushi Masago

Masayasu Nishimura

Masahiro Kawaguchi

Kouichi Taira

Yasuhiro Shintani

Toshihisa Hara

Motohisa Miyafuji

Shinya Katsura

Hiroshi Sakamoto

Yukio Sugishita

Kenju Minamoto

Taro Kuroda

Mitsuhiro Ohkubo

Akinori Tsuchiya

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width &#x3b2; of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheet for electric and electronic part

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width p of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200) /I (220)) of intensity of diffraction of (1 (200)) from the (200) plane in the sheet surface to intensity of diffraction of (I (220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheets for electrical/electronic part

A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu&#x2014;Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.

Terminal for engaging type connector

A Cu&#x2014;Fe&#x2014;P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 &#x3bc;m or less and a maximum height Rmax is 1.5 &#x3bc;m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Copper alloy sheet for electric and electronic parts

A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

Copper alloy sheet and QFN package

Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu&#x2014;Sn alloy covering layer having an average thickness of 0.2 to 3.0 &#x3bc;m; and an Sn covering layer, the Cu&#x2014;Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [Dof the minimum inscribed circle of the Sn covering layer is 0.2 &#x3bc;m or less, the diameter [Dof the maximum inscribed circle of the Sn covering layer is 1.2 to 20 &#x3bc;m, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu&#x2014;Sn alloy covering layer is 0.2 &#x3bc;m or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 &#x3bc;m or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

Conductive material for a connecting part

A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &#x3bc;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &#x3bc;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &#x3bc;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &#x3bc;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Plated copper alloy material and process for production thereof

A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

The copper alloy tube disclosed here contains 0.05 to 1.5 wt. % of Mn and deoxidized copper containing oxygen concentration at 100 ppm or less. At least one element selected from a group of elements comprising P, B, Li, Pb and Sb can be added at the amount of 0.20 wt. % or less in total. At least one element selected from another group of elements comprising Cr, Ti, Zr, Al and Si also can be added at the amount of 0.50 wt. % or less in total. Further, at least one element selected from other group of elements comprising Mg, Fe, Co, Ag, In and As can be added at the amount of 1.0 wt. % or less in total. Furthermore, at least one element selected from a group of elements comprising Zn and Ni can be added at the amount 5.0 wt. % or less in total. Thereby, an corrosion resistant copper alloy tube having better corrosion resistant property against the ant-nest type corrosion which is specific problem for refrigerant tubes and tubes for the heat exchanger and also better brazing property can be provided.

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Shimonoseki, Japan

Ryoichi Ozaki