Sony Semiconductor Solutions Corporation

Sony Corporation

Hoya Corporation

Tokyo Women's Medical University

Ryoichi Nakamura

Hiroshi Takahashi

Hiroyuki Kawashima

Yoshihisa Kagawa

Yuusaku Kobayashi

Hidenori Maeda

Takashi Suzuki

Masayuki Yamato

Teruo Okano

Masanori Maeda

Hidenobu Tsugawa

Hidenori Takushima

Takamasa Onuki

Masato Kanzaki

Kiichi Ishikawa

Hiroshi Iseki

Shigeru Nagai

A semiconductor device according to an embodiment of the present disclosure includes: a first substrate including a first junction portion; and a second substrate including a second junction portion. The second junction portion is joined to the first junction portion. The first substrate further includes a first multilayer wiring layer in which one surface of a first wiring line faces a first insulating layer and another surface opposed to the one surface is in contact with a second insulating layer. The first multilayer wiring layer is electrically coupled to the first junction portion via the first insulating layer. The first wiring line is formed closest to a junction surface with the second substrate. The second insulating layer has a lower relative dielectric constant than a relative dielectric constant of the first insulating layer.

Semiconductor device and method of manufacturing semiconductor device

An imaging device according to an embodiment of the present disclosure including a first chip; a support substrate; and a second chip. The support substrate includes an excavated portion in a region opposed to the first chip. The excavated portion has a shape of a recess or a shape of a hole. The second chip is disposed in the excavated portion of the support substrate. The second chip is electrically coupled to the first chip. At least one of the first chip or the second chip has a photoelectric conversion function.

Imaging device

Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.

Solid-state imaging device

Disclosed herein is a semiconductor memory device including a plurality of memory cells including first and second inverters each having first and second driver transistors and first and second load transistors and including first and second memory node, and first and second transfer transistors. The of the first and second transfer transistors is connected to each of the first and memory nodes respectively. The memory cell is connected to a bit line and complementary bit line via the first and second transfer transistors respectively wherein a supply voltage applied to the bit line and the complementary bit line is lower than a supply voltage applied to the load transistors, and at least a memory-node-side end of a gate insulating film of the first driver transistor, second driver transistor, first load transistor, and the second load transistor have a thickness larger than a thickness of a gate insulating film of the other part.

Semiconductor memory device and method for manufacturing same

A therapeutic-substance carrying/administering appliance includes a cylindrical outer sheath; a slide member installed in the cylindrical outer sheath to be slidable therein; and a sheet supporting member, connected to a distal end of the slide member and made of a resilient material, for supporting a sheet-shaped therapeutic substance. The sheet supporting member is held in a flat unrolled shape in a free state in which the sheet supporting member projects outwardly from a distal end of the cylindrical outer sheath. When the sheet supporting member is in the free state, sliding the slide member in a retracting direction causes the sheet supporting member to contact the distal end of the cylindrical outer sheath, and subsequently further moving the slide member in the retracting direction causes the sheet supporting member to be retracted into the cylindrical outer sheath while being deformed into a tubular shape.

Therapeutic-substance carrying/administering appliance

Growing community of inventors

Kanagawa, Japan

Ryoichi Nakamura