Nippon Steel Corporation

Taisei Corporation

Geostr Corporation

Ryoichi Naka

Shinichi Suzuki

Motohiro Nakayama

Tatsuya Kanamaru

Katutoshi A Arai

Kazutsugu Nakajima

Hiroo Goshi

Yukimasa Suemitsu

Yutaka Fujino

Seiichi Satoh

Shinichi Nakata

Osamu Ishita

Toshihiko Yoshizumi

Fumio Kondoh

Tukasi Chiba

The present invention relates to a novel easily-cuttable tunnel segment structure used for the departure of a shield machine from a main tunnel to a branch tunnel or the return to the main tunnel from the branch tunnel, and provides an easily-cuttable tunnel segment structureconstructed by connecting a plurality of easily-cuttable tunnel segment piecesin the longitudinal direction of a tunnel, wherein at least an easily-cuttable areais formed by concretein which easily-cuttable reinforcement members are arranged, and a join disposed at least in the easily-cuttable areain the longitudinal direction has an easily-cuttable join structure.

Easily-cuttable tunnel segment structure

A plated steel strip having an enhanced corrosion and rust resistance and an improved paint-coating property comprises a principal plating layer formed on a steel strip substrate and comprising a co-deposited zinc-chromium based alloy which comprises more than 5% by weight but not more than 40% by weight of chromium and the balance of zinc.

Corrosion resistant Zn-Cr plated steel strip

Corrosion resistant plated steel strip and method for producing same

In a process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip, by bringing, within an electrolytic liquid, a single surface-plated metal strip which serves as an anode plate, into a location at which the non-plated surface of the anode single surface-plated metal strip faces in parallel to and is spaced from a cathode plate, and by applying a principal voltage between the anode metal strip and said cathode plate to electrolytically remove metal deposit from the non-plated surface; whereby undesirable stripping of portions of the plated metal layer in side edge portions of the plated surface of the metal strip is prevented by arranging supplementary anode plates within the electrolytic liquid in such a manner that the supplementary anode plates face in parallel to and are spaced from side edge portions of the plated surface of the anode metal strip, and then, while the principal voltage is applied between the anode metal strip and the cathode plate, a supplementary voltage is applied between the supplementary anode plates and the metal strip, the electric potential of each supplementary anode plate being higher than that of the metal strip.

Process for electrolytically removing metal deposit from a non-plated

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Tokyo, Japan

Ryoichi Naka