Murata Manufacturing Co., Ltd.

Ryoichi Morimoto

Jitsuho Hirota

Tetsuya Kimura

Kenjiro Okaguchi

Koji Fujimoto

Shinya Yamamoto

Koichi Nitta

Tatsuya Funaki

Toru Yabe

A sensor for detecting an analyte in liquid includes a base substrate provided with openings and electrode lands on one surface thereof and SAW elements each provided with a sensing portion having at least one IDT electrode on one side. The SAW elements are mounted on the base substrate with bump electrodes by a flip-chip bonding method so that the sensing portions of the SAW elements face the openings of the base substrate. At least one of the sensing portions is coated with a reaction membrane which binds to an analyte.

Sensor for detecting analyte in liquid and device for detecting analyte in liquid using the same

A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof

An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste ( ) is supplied to electrodes ( ) for receiving surface-mount components ( ), and the surface-mount components ( ) are provisionally fixed on the electrodes ( ) with the high-temperature solder paste ( ). In addition, flux ( ) is applied to an electrode ( ) for receiving an IC ( ) that is provided with eutectic solder bumps ( ) or on the eutectic solder bumps ( ), and the IC ( ) is provisionally fixed on the electrode ( ) with the flux ( ). Then, a wiring substrate ( ) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components ( ) and the IC ( ) are reflow-soldered.

Electronic component mounting method

An electronic component connecting method of connecting a first electronic component and a second electronic component via a connecting structure like a bump electrode in which a thermosetting conductive adhesive is applied on connecting electrodes on an IC chip, which serves as the first electronic component, by printing or the like, and is hardened, whereby tapered projecting electrodes as bump electrodes are formed to project in the form of, for example, a circular cone. Then, a conductive adhesive for connection is applied on the projecting electrodes. Before the conductive adhesive for connection is hardened, the IC chip is aligned with a wiring board, which serves as the second electronic component, so that the ends of the projecting electrodes and connecting electrodes on the wiring board are in contact with each other. In this aligned state, the conductive adhesive for connection is hardened.

Growing community of inventors

Shiga-ken, Japan

Ryoichi Morimoto