Hitachi, Ltd.

Other

Lg Electronics Inc.

Renesas Technology Corp.

Hitachi Computer Electronics Co., Ltd.

Ryoichi Kurihara

Akira Yamagiwa

Toshitsugu Takekuma

Kiyoo Itoh

Masashi Horiguchi

Takeshi Sakata

Takayuki Kawahara

Masakazu Aoki

Ryoichi Hori

Kunio Uchiyama

Takashi Moriyama

Yasuhiro Uemura

Masakazu Sakaue

Toshitsuqu Takekuma

Hideki Osaka

Takashi Maruyama

Masao Inoue

Mikihiro Tanaka

Koichi Kimura

Toshihiko Ogura

Hiroaki Aotsu

Hiromichi Enomoto

Tadashi Kyoda

Hiroshi Ito

Yoshio Kiriu

Kenji Kashiwagi

Toyohiko Komatsu

Masahiro Kitano

Hiroshi Kosuge

Takashi Tabei

Kouji Hara

Nobuaki Ejima

Kazuya Iwasaki

A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

Signal transmitting device suited to fast signal transmission

Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis. Also disclosed here is an upgraded module structure permitting a multiple-stage module setup together with an advanced cooling structure for modules.

Logic emulation module and logic emulation board

A signal transmission system includes a first circuit block having a first output circuit for producing a first signal, a plurality of second circuit blocks each including a first receiving circuit for receiving the first signal, and transmission lines connected between the first circuit block and the second circuit blocks, wherein the first circuit block further includes a second output circuit for producing a second signal, and wherein each of the second circuit blocks further includes a second receiving circuit for receiving the second signal, the first receiving circuit latching the first signal in synchronism with the second signal, removing the unsuccessfulness in the signal transmission and reception due to the propagation delay of signals between circuits.

Signal transmission system

In a printed board mounting method using a directional coupling bus for a high-speed data transfer, multi-bit data are transferred between nodes at a low cost. For this purpose, to transfer multi-bit data by directional coupling, a one-bit multi-coupling wiring network is vertically configured in a multilayered printed board. This minimizes the width of an area occupied by each bit along a wiring direction of the board to thereby implement a multi-bit configuration.

Directional coupling bus system using printed board

A signal transmitting circuit includes one or more circuit blocks having a driving circuit and an intra-block transmission line for transmitting a signal produced by the driving circuit, one or more circuit blocks having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between both of the driving and receiving circuit blocks. Inter-block transmission line is terminated at one or two ends by one or two resistors having substantially the same impedance as the interblock transmission lien itself. Each of the intra-block transmission line is provided with a resistance element having a resistance equal to or close to a value derived by subtracting a half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

Circuit module connected to a transmission line including arrangement to suppress reflections at a branch point of the transmission line

Semiconductor memory

A semiconductor integrated circuit device is composed of logic gates each provided with at least two MOS transistors. The logic gates are connected to a first potential point and a second potential point. The semiconductor integrated circuit device includes a current control device connected between the logic gate and the first potential point and/or between the logic gate and the second potential point for controlling a value of a current flowing in the logic gate depending on an operating state of the logic gate. The circuit can be used in devices that cycle in operation between high and low power consumption modes, such as microprocessors that have both an operation mode and a low power back-up or sleep mode used for power reduction.

Semiconductor integrated circuit device having power reduction mechanism

The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a high heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.

Circuit module and information processing apparatus

Growing community of inventors

Hadano, Japan

Ryoichi Kurihara