Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Ryoichi Inanami

Ikuo Yoneda

Shunko Magoshi

Hiroshi Tokue

Tetsuro Nakasugi

Shinji Mikami

Takumi Ota

Shinichi Ito

Takashi Sato

Masamitsu Itoh

Atsushi Ando

Masafumi Asano

Hiroshi Koizumi

Suigen Kyoh

Masayuki Hatano

Yasuo Matsuoka

Yumi Nakajima

Katsuya Okumura

Akihiro Kojima

Masaru Suzuki

Satoshi Tanaka

Hirofumi Inoue

Shouhei Kousai

Hiroko Nakamura

Koichi Kokubun

Manabu Takakuwa

Takuya Kono

Akiko Mimotogi

Yongfang Li

Kazuto Matsuki

Takeshi Koshiba

Kentaro Kasa

Hiroyuki Morinaga

Masato Saito

Minoru Inomoto

A method of designing a template pattern used for imprint lithography, includes generating data of a dummy template pattern to be formed in a third area between first and second areas of a template based on data of a design pattern of the template, the data of the dummy template pattern being generated so that a third surface area ratio showing a ratio of a surface area of the third area to an area of the third area is set smaller than a first surface area ratio showing a ratio of a surface area of the first area to an area of the first area and larger than a second surface area ratio showing a ratio of a surface area of the second area to an area of the second area.

Method of designing a template pattern, method of manufacturing a template and method of manufacturing a semiconductor device

Certain embodiments provide an imprint recipe creating device comprising first to fifth creation units. The first creation unit creates inside-standard-shot information by use of filling amount information and residual film thickness information. The second creation unit creates first inside-substrate-surface information by use of shot position information, edge information, and the inside-standard-shot information. The third creation unit creates first correction information by use of unevenness information indicating unevenness in a substrate and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface. The fourth creation unit creates second correction information by use of post-process information indicating the variations in processing size. The fifth creation unit synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information.

Imprint recipe creating device and imprint device

An imprint pattern forming method includes contacting a template with a pattern in a front surface with an imprint material formed in a substrate to fill the imprint material into the pattern, curing the imprint material filled in the pattern to form an imprint material pattern, and after forming the imprint material pattern, separating the template from the imprint material pattern while applying pressure to the back surface of the template.

Imprint pattern forming method

According to one embodiment, a plurality of test drop recipes are first created based on design data on a semiconductor integrated circuit. Based on a defect inspection result of a pattern of a hardening resin material, which is formed by pressing a template on which patterns of the semiconductor integrated circuit are formed onto the hardening resin material applied to a substrate to be processed by use of the test drop recipes, a drop recipe with least defects is selected per press position on the substrate to be processed from the test drop recipes. The selected drop recipes for respective press positions are collected per functional circuit block configuring the semiconductor integrated circuit, thereby to generate a drop recipe creation assistant database.

Drop recipe creating method, database creating method and medium

According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.

Pattern transfer mold and pattern formation method

According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.

Pattern forming method, processing method, and processing apparatus

According to one embodiment, a pattern formation method includes preparing a mask pattern for interference, producing Talbot interference, and forming a pattern by blocking a part of interference light. The mask pattern for interference is arranged periodically a plurality of light transmissive portions. The Talbot interference is based on a transmitted light. The transmitted light is transmitted through the light transmissive portions by applying a light to the mask pattern for interference. The part of interference light is produced by the Talbot interference by means of a mask pattern for light blocking and applying another part of the interference light transmitted through the mask pattern for light blocking to an exposure object member.

Pattern formation method, mask for exposure, and exposure apparatus

According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on the major surface. Each of the first support units includes a suction-holding unit capable of holding a substrate by suction. The suction-holding unit is movable along a first direction perpendicular to the major surface and a second direction parallel to the major surface.

Substrate holding apparatus, pattern transfer apparatus, and pattern transfer method

According to one embodiment, a stage apparatus includes a height control unit includes height control elements each which is drove in an upward/downward direction independently, a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas. The control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in a allowable range, and set the height of the area out of the allowable range again by the height control elements.

Stage apparatus and process apparatus

In one embodiment, a method for cleaning a reticle stage of an extreme ultraviolet exposure apparatus is disclosed. The method can include pressing a particle catching layer of a cleaning reticle onto the reticle stage, and the cleaning reticle includes the particle catching layer formed on a substrate. The method can include peeling the cleaning reticle from the reticle stage. The method can include removing the particle catching layer from the substrate. I addition, the method can include forming a new particle catching layer on the substrate having the particle catching layer removed.

Cleaning reticle, method for cleaning reticle stage, and method for manufacturing semiconductor device

A template formed of an optically-transparent material according to an embodiment includes a contact surface which contacts a resist material, a concave portion for resist pattern formed on the contact surface in which the resist material is filled and cured so as to form a resist pattern part, and a concave portion for alignment mark formed on the contact surface which is used for an optical alignment of the template, includes an opening and a bottom portion and has a shape that an area of the opening is larger than that of the bottom portion or a shape that a depth thereof is deeper than that of the concave portion for resist pattern.

Template and method of manufacturing a semiconductor device

Growing community of inventors

Yokohama, Japan

Ryoichi Inanami