Google Inc.

Ryohei Urata

Hong Liu

Xiang Zhou

Cedric Fung Lam

Lieven Verslegers

Christopher Lyle Johnson

Teckgyu Kang

Amin Vahdat

Daoyi Wang

Melanie Beauchemin

Zuowei Shen

Woon-Seong Kwon

Jill Berger

Jan Petykiewicz

Xiaoxue Zhao

Woon Seong Kwon

Pedram Zare Dashti

Erji Mao

Junlan Zhou

Kevin Y Yasumura

Namhoon Kim

Alexander Shraer

Ben Warren Segura

Liming Wang

Chris Johnson

Kyle Fukuchi

Jamyuen Ko

Xiangjun Zhao

Nam Hoon Kim

Houle Gan

William F Edwards

Yut Loy Chan

Leon Poutievski

Yujeong Shim

Xu Zuo

Shinnosuke Yamamoto

Nathan Folkner

Wenzao Li

The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

ASIC package with photonics and vertical power delivery

Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.

System, apparatus, and architecture for migrating an optical communication network

An assembly includes a printed circuit board ('PCB'). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Structure for optimal XPU socket compression

Polarization-folding coherent optical technology for short reach optical communication

A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

Substrate coupled grating couplers in photonic integrated circuits

A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

Fixture and method for attaching fibers to V-grooves of photonic integrated circuit

An optical links diagnostic system (LDS) and its operation within an optical circuit switch (OCS) for measurement and diagnosis of fiber-optic network fiber performance and quality is disclosed. The LDS can contain two photodetectors, a laser source, and be coupled to an OCS. Optical circulators can further be linked to the OCS. The LDS can be used both as an optical time domain reflectometer (OTDR) or as an optical return loss (ORL) meter and can automate the diagnosis of the fiber optical network fiber insertion loss and return loss.

Optical link diagnostic system

The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit ('PIC'). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

Laser light source co-packaged with photonic integrated circuit and substrate

A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.

Integrated optical circulator enabling polarization diversity

Growing community of inventors

San Carlos, CA, United States of America

Ryohei Urata