Hitachi, Ltd.

Fujitsu Hitachi Plasma Display Limited

Hitachi Microcomputer Engineering, Ltd.

Ryohei Satoh

Michifumi Kawai

Mitugu Shirai

Masahito Ijuin

Masahide Harada

Akira Yabushita

Shigeaki Suzuki

Masashi Nishiki

Yuzo Taniguchi

Toru Nishikawa

Tetsuya Hayashida

Tomohiko Murase

Osamu Yamada

Hideaki Sasaki

Kiyoshi Matsui

Fumiyuki Kobayashi

Tateoki Miyauchi

Masakazu Ishino

Takaji Takenaka

Tomohiro Murase

Makoto Fukushima

Yoshimi Kawanami

Takashi Inoue

Yutaka Watanabe

Mikio Hongo

Shinichi Kazui

Mamoru Mita

Kaoru Katayama

Kazuo Hirota

Toshihiko Ohta

Toshitada Netsu

Akihiro Ando

Hiroshi Yamaguchi

Keizo Suzuki

Hiroshi Fukuda

Hitoshi Yokono

Tsutomu Takahashi

Fumihiro Namiki

Akira Shimase

Naoya Kanda

Kenji Takeda

Koji Suzuki

Nobuyuki Ushifusa

Masayuki Shibata

Yasuhiro Iwata

Masahide Okamoto

Masaji Ishigaki

Tsuyoshi Fujita

Kazuhiko Horikoshi

Mitsugu Shirai

Kenichi Yamamoto

Yasuhiko Kunii

Akira Murata

Seiichi Yasumoto

Tsutomu Imai

Masakazu Yamamoto

Suguru Sakaguchi

Hideo Sotokawa

Takayuki Uda

Shirun Ho

Takao Terabayashi

Seiichi Tsuchida

Mamoru Kobayashi

Shousaku Ishihara

Shigenobu Maruyama

Mitsunori Tamura

Katsuro Mizukoshi

Yoshihiro Kato

Kazunori Ishizuka

Tadashi Furukawa

Tositada Netsu

Akihiro Fujinaga

Hideki Watanabe

Minoru Tanaka

Eiji Matsuda

Muneo Oshima

Katsuhiro Arakawa

Kenichi Hamamura

Hiroyuki Hidaka

Haruhisa Sakamoto

Haruhiko Imada

Masayuki Kyoui

Osami Kaneto

Toshinori Ameya

Kiyotaka Wasai

Shoichi Iwanaga

Kiyoshi Kanai

Shinji Abe

Masashi Ohkubo

Masahide Hara

Hiroko Takehara

Yutaka Naito

A rib structure for a display device includes a light-transmissive rib structure containing therein a material absorbent of visible light so that a visible light absorption distance is 40 to 1200 &#x3bc;m (the visible light absorption distance L (&#x3bc;m) means a distance such that visible light decreases to exp(&#x2212;T/L) times less in connection to the travel distance T (&#x3bc;m), that is, visible light is absorbed by 1-exp(&#x2212;T/L)).

Rib structure for display device and its manufacture process

A gas discharge type display apparatus includes a front substrate having a plurality of first electrodes and a back substrate having a plurality of second electrodes and at least ones of the first and second electrodes are made of the photosensitive material containing silver exposed by using the laser thereby, making a mask unnecessary.

Wiring board and gas discharge type display apparatus using the same

A gas discharge display device having a first substrate, a plurality of first electrodes having a substantially rectangular form being arranged on the first substrate, a plurality of second electrodes, respective ones of the plurality of second electrodes being formed on respective ones of the plurality of first electrodes, and each of the plurality of second electrodes having an extension extending beyond an end of a respective one of the plurality of first electrodes on which respective ones of the plurality of second electrodes are formed and in an oblique direction therefrom. The extension of the plurality of second electrodes extend beyond opposite ends of alternate ones of the plurality of first electrodes.

Method of making gas discharge display panel and gas discharge display device

A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.

Wiring substrate and gas discharge display device

A method of making a gas discharge display panel and a gas discharge display device using laser processing so that the manufacturing time to form wiring on a substrate thereof is significantly reduced. In order to achieve this, the gas discharge display panel is provided with a first substrate having a plurality of first electrodes and a plurality of second electrodes, and the first electrodes are laser processed to have a substantially rectangular shape. The second electrodes are formed on the first electrodes, and a second substrate having a plurality of third electrodes which is opposed to the first substrate is provided.

Gas discharge display panel and gas discharge display device having electrodes formed by laser processing

Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes

A method of making a gas discharge display panel including the steps of providing a first substrate having a plurality of first electrodes and a plurality of second electrodes, laser processing said first electrodes into a rectangular form, forming the second electrodes on the first electrodes and providing a second substrate having a plurality of third electrodes and being opposed to the first substrate.

A plasma display system has a plasma display panel including a pair of base plates for forming a plurality of discharge cells therebetween, and a plurality of pairs of electrodes for sustaining discharge to form plasma through a dielectric substance thereon in the discharge cells. The pairs of electrodes for sustaining discharge are disposed on a same one of the pair of base plates. The plasma display panel is configured such that a discharge current integrated over 40% of a discharge time Td from a start of the discharge time Td is smaller than a discharge current integrated over a remainder of the discharge time Td in one discharge, wherein the discharge time Td is defined as a time interval over which a discharge current does not drop to less than 5% of its maximum value in one discharge.

Plasma display system

Wiring substrate and gas discharge display device and method therefor

In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Method of fabricating an electronic circuit device and apparatus for performing the method

A manufacturing method for a gas discharge type display panel makes it possible to manufacture an environmentally friendly substrate with high accuracy and yet at low cost. According to the manufacturing methods electrodes are formed on a back substrate by photolithography or printing, then a glass paste is printed to a height of approximately 10 &mgr;m-500 &mgr;m by printing. A barrier rib blanks are produced by rolling under pressure the glass paste by using a roller provided with grooves. The roller is heated in advance. The barrier rib blanks are sintered into the barrier ribs.

Manufacturing method for gas discharge type display panel

An electrode structure as well as the fabrication method thereof is disclosed which may enable successful pad layout conversion of interconnection electrode pads on the periphery of an associated IC chip to a grid array of rows and columns of terminal solder pads arranged occupying the entire area of the opposite surface of the chip while permitting use of a minimized length of wire leads for interconnection therebetween. This is achieved by (i) preparing a flat square IC chip which has an array of regularly spaced peripheral bonding pads the number of which along each of four chip sides is equally defined by a function of 2i(2i-1) where 'i' is an integer and which also has external connection pads made of aluminum, (ii) sequentially forming nickel and gold coat films on the chip by electroless plating techniques, (iii) electrically coupling by metal contacts using thermal compression-bonding techniques the peripheral bonding pads to the pad layout conversion substrate for rearrangement of the peripheral bonding pads into the grid array of solder pads, and (iv) filling an adhesion resin between the conversion substrate and the IC chip.

Electrode structure of a wiring substrate of semiconductor device having

An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.

Electronic device bonding method and electronic circuit apparatus

A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.

Multilayer substrates methods for manufacturing multilayer substrates

A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.

Multilayer circuit substrate with circuit repairing function, and

Growing community of inventors

Yokohama, Japan

Ryohei Satoh