Hitachi, Ltd.

Fujitsu Client Computing Limited

Fujitsu Corporation

Ryohei Sato

Ikki Tatsukami

Mitsugu Shirai

Masahito Ijuin

Toru Nishikawa

Takashi Abe

Takashi Naito

Masahide Harada

Tetsuya Hayashida

Yuzo Taniguchi

Yasutaka Suzuki

Kosuke Inoue

Shigehisa Motowaki

Michifumi Kawai

Akira Saito

Yoshihiro Kato

Tomohiko Murase

Ushio Oshima

Morris Sung

Albert Jiang

Makoto Furukawa

Yasuhiro Matsuoka

Frank Müller Augste

A hinge includes a first part disposed in a first member and a second part disposed on a second member. The first part includes a first curved part with an arc shape protruding to outside in a radial direction of a rotational center, and a second curved part disposed outside the first curved part in the radial direction of the rotational center with spacing from the first curved part with an arc shape along the first curved part. The second part includes a connection disposed between the first curved part and the second curved part, wherein the connection moves smoothly along the first curved part and the second curved part about the rotational center. The second part couples, with the first part, the first member and the second member together to allow the first member and the second member to relatively rotate about the rotational center.

Hinge and housing for electronic device

An information processing device includes a rail member that is attached to a drive unit, a drive case into which the drive unit having the rail member attached thereto is inserted, and a bar member that includes a locking portion. An opening is formed in the rail member, an opening is formed at a position in the drive case corresponding to the opening of the rail member, and the locking portion of the bar member is inserted into the opening of the rail member and the opening of the drive case in a state in which the drive unit is inserted into a predetermined position of the drive case.

Information processing device

An electronic device includes: a housing provided with an opening that accommodates a component; a cover member that covers the opening; a projecting part that projects from an inside face of the housing; a slide knob slidably provided to a surface of the housing; and an elastic slide lock member that fixes the cover member to the housing, wherein the elastic slide lock member includes: a movement part that is coupled to the slide knob, moves together with the slide knob, and is provided with a fixing projection; a fixing part that is rotatably supported by the projecting part of the housing; and a coupling part that couples the movement part and the fixing part and is elastically deformable.

Electronic device and elastic slide lock member

In the manufacture of a gas discharge type display panel, by applying a sealing operation along with an exhausting operation, the sealing glassis broken down by a pressure difference between the inside and outside of the panel, and thus, the clearance gap between the substrates can be controlled as desired. In addition, the gaseous component that is unnecessary for the discharge operation is exhausted by setting the temperature of the amorphous sealing glass to exceed its softening-point and be no more than its working point. In the structure of the gas discharge type display panel, a protruding portion having a radius of curvature between 0.1 mm and 1 mm is formed on the sealing glass to reduce the dispersion in the thickness direction of the sealing glass, or the cross-sectional shape of the sealing glass is made convex both at its inside end part and its outside end part.

Gas discharge type display panel and production method therefor

The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Process for manufacturing electronic circuit devices

In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Soldering method and apparatus for use in connecting electronic circuit

Growing community of inventors

Kawasaki, Japan

Ryohei Sato