Denso Corporation

Nec Electronics Corporation

Nippon Soken, Inc.

Ntt Docomo, Inc.

Ryohei Kataoka

Yuji Sugimoto

Tadao Suzuki

Koji Kondo

Tomohiro Yokochi

Akimori Hayashi

Katsunobu Suzuki

Makoto Nakagoshi

Tadashi Murai

Ryuichi Oikawa

Hirohito Matsui

Yasumune Yukizaki

Hisashi Takeshita

Gentaro Masuda

Chiho Ogihara

Hiroyuki Itazu

Miyuki Mizoguchi

Mio Okamoto

Naoko Sera

A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.

Vehicle-mounted antenna device

A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.

A vehicular antenna apparatus includes a substrate, a circuit portion, a case, and a heat transfer path. The substrate has an antenna portion. The circuit portion is mounted on the substrate and configures at least a part of a wireless communication circuit electrically coupled with the antenna portion. The case is made of resin material and configures a protruded portion of an outer surface of a vehicle. The substrate and the circuit portion are arranged in the case. The heat transfer path is arranged between the circuit portion and the case, and has a thermal conductivity higher than air. The circuit portion is electrically coupled with the antenna portion by a solid phase diffusion bonding.

Vehicular antenna apparatus

A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.

Antenna apparatus

A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.

Printed circuit board having colored outer layer

Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi&#x2212;Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi&#x2212;Pc| is larger than criteria B (|Pi&#x2212;Pc|&#x3e;B), so transmission power faults can be detected without detecting the transmission power.

Radio terminal and fault detection method

A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.

Growing community of inventors

Okazaki, Japan

Ryohei Kataoka