Lintec Corporation

Toyo Ink Mfg. Co., Ltd.

Toyo-morton, Ltd.

Ryohei Ikeda

Akira Ikeda

Naoya Okamoto

Katsuhiko Horigome

Yasuki Nakajima

Keishi Fukuda

[Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a semiconductor device including this, and a composite sheet. [Solving Means] A semiconductor protective filmaccording to an embodiment of the present invention includes a protective layerformed of a non-conductive inorganic material and an adhesive layerprovided on one surface of the protective layer. The protective layerincludes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.

Protective film for semiconductors, semiconductor device, and composite sheet

Disclosed is an adhesive and a packaging laminate produced by using the same. The adhesive contains a polyisocyanate and a partially acid-modified polyol which is a product of reacting a polyol with anhydrotrimellitic acid and an anhydrotrimellitate ester at a ratio such that the anhydrotrimellitic acid is 10 to 70% by mass and the anhydrotrimellitate ester is 90 to 30% by mass, as the sum of the anhydrotrimellitic acid and the anhydrotrimellitate ester is 100% by mass. The packaging laminate has a first and second sheet-shaped substrates and the above adhesive through which the first and second sheet-shaped substrates are laminated.

Adhesive and packaging laminate using the same

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Tokyo, Japan

Ryohei Ikeda