Mitsubishi Electric Corporation

Mitsubishi Electric Cornoration

Ryohei Hayashi

Kohei Seike

Jiro Yoshizawa

Niki Kitahama

Goki Furuya

Yasuhiro Komiya

Hiroaki Takahashi

Masahiro Noguchi

Mitsuo Sone

Kohei Ando

Hirofumi Miyoshi

A rotating electrical machine such that positional deviation caused by a part tolerance can be absorbed in an electrical connection between a power conversion device and a rotating electrical machine main body, and size can be reduced without a structure becoming complex, is obtained. The rotating electrical machine is characterized by including a power terminal unit of the rotating electrical machine main body housed in a housing, the power conversion device fixed to the housing, and a multilayer bus bar connected to the power terminal unit of the rotating electrical machine main body as a power terminal of the power conversion device, wherein the multilayer bus bar has flexibility, and is bent by being connected to the power terminal unit.

Rotating electrical machine

Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.

Power conversion device

A member to be fastened on one side of which a member to be fixed is placed; a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened; a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein; a supporting column which is provided on the support and bends toward the member to be fastened; a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; and a fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole.

Fastening structure and power conversion apparatus using fastening structure

Provided is a power conversion device that has improved assembling workability and that realizes downsizing thereof. The power conversion device includes: an electrical component; a casing enclosing the electrical component and terminals connected to the electrical component and an outside, the casing having a plurality of opening portions in which the terminals are disposed; and a casing lid covering the opening portions. A shaft seal provided so as to be in contact with a side surface contiguous with a rim of an opening portion among the opening portions, and a surface seal provided so as to be in contact with a surface contiguous with a rim of an opening portion among the opening portions, are disposed so as to be in contact with the casing lid.

Provided is a power conversion device, including: a semiconductor module including a semiconductor switching element; a heat sink configured to cool the semiconductor module; a spring member configured to press the semiconductor module onto the heat sink; a casing configured to accommodate the semiconductor module and the spring member; and a bridge-like structure configured to press the semiconductor module onto the heat sink through intermediation of the spring member when the casing is mounted to the heat sink.

Provided is a connection structure for a power conversion device to be mounted in a vehicle, including: a casing of the power conversion device; an electric connection part, which is to be mechanically connected to the casing, and is configured to electrically connect the power conversion device and an external device to each other; and an electric conductor configured to electrically connect the power conversion device and the electric connection part to each other, wherein the casing and the electric connection part are mechanically connected to each other through intermediation of an anti-vibration structure, and wherein the electric conductor has such flexibility as to be able to follow a relative displacement between the casing and the electric connection part.

Connection structure for power conversion device

Provided is an electric device that includes a connector holder for positioning a connector relative to a control board and fixing a harness. In the electric device, a board-in connector for wire-to-board connection is disposed at an end of a harness for electrical connection, and terminals of the board-in connector are soldered and fixed to terminals in a control board. The electric device includes a connector holder fixed to a housing together with the control board. The connector holder includes a fixation portion for fixing the board-in connector to the connector holder, and a holding portion for holding and fixing the harness.

Electric device

A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.

Growing community of inventors

Tokyo, Japan

Ryohei Hayashi