Yamaha Hatsudoki Kabushiki Kaisha

Ryodai Ito

Akihiro Suzuki

Shimpei Takeda

Masahiro Sano

Yasumi Yamamura

A mold () according to an embodiment of the present invention is a mold which is formed by additive manufacturing. The mold includes: a heat medium channel () for a heat medium to flow through, the heat medium channel being provided inside the mold; a medium introduction port () at which the heat medium is to be introduced into the mold; a medium discharge port () at which the heat medium is to be discharged out of the mold; and a buffer layer () located between a mold surface () and the heat medium channel. The buffer layer includes a low-melting percentage portion () having a lower melting percentage than does any portion inside the mold other than the buffer layer.

Growing community of inventors

Iwata, Japan

Ryodai Ito