Tokyo Electron Limited

Ryo Yamamoto

Shota Umezaki

Hitoshi Kosugi

Kouzou Tachibana

Yoshinori Ikeda

Takashi Uno

Shigeru Moriyama

A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit () which is rotatable, a step of arranging a top plate portion () above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion () to wash the substrate and the top plate portion () with the rinsing liquid (Lr).

Substrate processing method and substrate processing apparatus

A method includes rotating a substrate, supplying a first processing liquid from a first nozzle to the substrate during a first period, and supplying a second processing liquid from a second nozzle to the substrate during a second period. First and second liquid columns are formed by the first and second processing liquids during at least partially overlapped period of the first and second periods, respectively. The shapes and arrangements of the first and second liquid columns satisfy that: at least one of first and second central axis lines of the first and second liquid columns is inclined with respect to a rotational axis line of the substrate, first and second cut surfaces obtained by cutting the first and second liquid columns along a horizontal plane at least partially overlap each other, and any point on the first central axis line is located on the second central axis line.

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Koshi, Japan

Ryo Yamamoto