Yamaichi Electronics Co., Ltd.

Ryo Ujike

Masaru Sato

Kazunori Nakano

Takeyuki Suzuki

Katsumi Suzuki

Eiji Kobori

Yoshinori Wakabayashi

Takahiro Oikawa

Eisaku Tsubota

Kenji Ichihara

To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off. By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substratecan be stably formed with high precision.

Manufacturing method for probe contact

Upon an assembly of a probe head unit, the relative positions of the probe pinsto those of the electrode groupE in the pitch-changing substrateare determined by making the positions of the through-holesA,B,C andD in the contact blockto coincide with the positioning marksMA,MB,MC andMD in the pitch-changing substrate

Method for assembling testing equipment for semiconductor substrate

Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Socket for semiconductor device

In a state wherein front ends of latch membersA andB are apart from each other so that the upper surface of an alignment plate/positioning memberis outside, a pressing sectionPU of a heat sink memberis brought into contact with the periphery of a semiconductor device

Semiconductor device socket

A socket of the invention includes a socket body, a plurality of contacts respectively having a movable piece and a stationary piece, a slidable contact moving member and a lever having a pushing portion and a pressing member. A plurality of contact displacing portions of the contact moving member are respectively positioned between the movable and stationary piece of each contact. The contact moving member is urged to prevent the contact displacing portion from moving each movable piece. The pressing member includes a curved fulcrum portion and an operating portion curved oppositely to the fulcrum portion. A first restricting portion of the socket body is in contact with the fulcrum portion and a second restricting portion of the contact moving member can be in contact with the fulcrum portion. The operating portion of the pressing member abuts to the contact moving member.

Socket for electronic element

A plurality of contact terminals include movable contact portions disposed slantingly oppositely to each other, and the movable contact portion of the contact terminal is disposed movably up to the neighborhood of a position adjacent to the movable contact portion of the adjacent contact terminal. In this situation, when the electrode of the semiconductor device is released from the contact terminal, the electrode is pressed by the back of the movable contact portion in the direction where the electrode is separated from the movable contact portion.

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Yokohama, Japan

Ryo Ujike