Nichia Corporation

Ryo Suzuki

Ikuko Baike

Tadao Hayashi

Yoshikazu Matsuda

Yoshikazu Takeuchi

Hirokazu Sasa

Takao Yamada

Tomoya Tsukioka

Masaya Miyazaki

A light-emitting device efficiently performs wavelength conversion and includes a light-emitting element having a light-emitting surface, a wavelength conversion member having an incident surface that is larger than the light-emitting surface of the light-emitting element, a light-transmissive member that includes a first portion disposed across a lateral surface of the light-emitting element and the incident surface of the wavelength conversion member, and a light-reflective member disposed to cover the lateral surface of the light-emitting element while being in contact with the first portion of the light-transmissive member. The incident surface of the wavelength conversion member faces the light-emitting surface of the light-emitting element and has an outer periphery located outward of an outer periphery of the light-emitting surface. The light-transmissive member further includes a second portion that extends from an end portion of the first portion between the light-reflective member and the incident surface of the wavelength conversion member.

Light-emitting device and method of manufacturing light-emitting device

A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

Light emitting device and method for manufacturing the same

A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes.

Light-emitting device

A light emitting device includes a light emitting element having a first face positioned on an emission face side of the light emitting device, a second face opposing the first face, and lateral faces disposed between the first face and the second face, a light transmissive member formed from a resin-containing material, covering at least a portion of the lateral faces of the light emitting element and having a first face positioned on the emission face side, a covering member covering an exterior of the light transmissive member and having a first face positioned on the emission face side, a wavelength converting member covering the first face of the light emitting element, the first face of the light transmissive member, and the first face of the covering member, and a light reflective film including a first reflective film portion made of an inorganic material disposed between the exterior of the light transmissive member and the covering member, and a second reflective film portion made of an inorganic material disposed between the first face of the covering member and the wavelength converting member.

Metal coating method, light-emitting device, and manufacturing method for the same

A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of corners where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

A metal coating method includes forming a metal layer on a substrate including a first member and a second member, the second member having a lower thermal conductivity than a thermal conductivity of the first member, and irradiating the metal layer formed on the first member and the second member with a laser beam such that, after irradiation, the metal layer formed on the first member remains, and the metal layer formed on the second member is removed.

A method for manufacturing a light emitting device includes preparing a light emitting element that includes a light transmissive substrate comprising a first main surface, a second main surface, and a side surface having a light transmitting part and a light absorbing part whose optical transmissivity is lower than that of the light transmitting part, and a semiconductor laminate that is provided to the first main surface of the light transmissive substrate, joining the light emitting element to an upper surface of a base body such that the base body is opposite to the side where the semiconductor laminate is provided, providing a support member that covers the side surface of the light emitting element and part of the base body, and removing the light absorbing part by thinning the light transmissive substrate from the second main surface side.

Method for manufacturing light emitting device

A method for manufacturing a light emitting device has: preparing a base body which comprises a pair of connection terminals; preparing a light emitting element which includes a substrate, a semiconductor laminate that is laminated on the substrate, and a pair of electrodes formed on the surface of the semiconductor laminate; joining the electrodes of the light emitting element to the connection terminals of the base body; covering the light emitting element with a sealing member; and removing at least a part of the sealing member and a part of the substrate of the light emitting element from the opposite side from the base body so that an upper surface of the sealing member is lower than an upper surface of the substrate of the light emitting element.

A method of manufacturing a light emitting device includes: disposing a group of electrically conductive members on a support substrate, the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements; placing the light emitting elements on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members, each of the light emitting elements being shifted from a corresponding one of the mounting portions; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member.

Method of manufacturing light emitting device

A light emitting device includes a substrate member, a light emitting element, a resin member, an insulating layer and a fluorescent material layer. The light emitting element is arranged on the substrate member. The resin member surrounds sides of the light emitting element, and has a top portion located higher than a light emission surface of the light emitting element. The insulating layer covers the light emission surface of the light emitting element and an outer wall surface and an inner wall surface of the top portion of the resin member. The fluorescent material layer covers a surface of the insulating layer.

Light emitting device including resin member surrounding sides of light emitting element

A method for manufacturing a light emitting device comprises (a) preparing a structure including a substrate, a semiconductor layer formed on the substrate, and a p-side electrode and an n-side electrode formed on the semiconductor layer; (b) preparing a support member including a p-side wiring and an n-side wiring on the same surface thereof; (c) electrically connecting the p-side electrode and the n-side electrode of the structure to the p-side wiring and the n-side wiring of the support member, respectively, using an anisotropic conductive material containing conductive particles and a first resin; and after step (c), (d) removing the substrate from the structure.

A light emitting element has a semiconductor layer, a pair of positive and negative electrodes, and a reinforcing portion. The pair of positive and negative electrodes is disposed on a lower face side of the semiconductor layer. The pair of electrodes is connected to the substrate. The reinforcing portion is disposed on an outer edge part of an upper face of the semiconductor layer. The reinforcing portion is made from a light-transmissive material. The upper face includes an exposed portion exposed from the reinforcing portion.

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Anan, Japan

Ryo Suzuki