Disco Corporation

Ryo Shimazu

Keisuke Nakano

Satoshi Yamanaka

Hiroki Miyamoto

Multiple holding surfaces of a chuck table are disposed in such a manner that the heights thereof from a reference surface are in increasing order along a first direction parallel to each of them. Thus, in a case of using this chuck table, creep-feed grinding for workpieces each held by a respective one of the multiple holding surfaces can be executed in states in which a grinding unit is positioned at different heights. In this case, the workpiece for which the creep-feed grinding has been executed is located on the lower side as viewed from the grinding unit when another workpiece is ground. Due to this, in this creep-feed grinding, a specific workpiece can be prevented from being ground twice.

Chuck table and grinding method of workpieces

One array of grindstones is used for in-feed grinding and creep-feed grinding. Therefore, it is not necessary to position a chuck table that is holding a plate-shaped workpiece with respect to two different arrays of grindstones. As a result, a period of time required to grind the plate-shaped workpiece can be shortened. Furthermore, lower surfaces of the grindstones are used for the in-feed grinding, whereas side surfaces of the grindstones are used for the creep-feed grinding. Consequently, the amount by which the grindstones are worn can be smaller than that in a case where the plate-shaped workpiece is ground to a predetermined thickness in only the in-feed grinding or the creep-feed grinding.

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Tokyo, Japan

Ryo Shimazu