Canon Kabushiki Kaisha

Ryo Sasaki

Takahiro Matsumoto

Toshiki Iwai

Ko Ishizuka

Wataru Yamaguchi

Koichi Masegi

Tomohiro Hoshino

The present invention provides an exposure apparatus that exposes a substrate via a projection optical system, the apparatus including a supply unit including a first channel to which a first gas containing air is supplied, a second channel to which a second gas higher in oxygen concentration than the first gas is supplied, and a third channel to which a third gas lower in oxygen concentration than the first gas is supplied, and configured to generate a mixture gas by using at least two of the first gas, the second gas, and the third gas, and supply the mixture gas to a space between the substrate and the projection optical system.

Exposure apparatus and method of manufacturing article

The present invention provides an evaluation method of evaluating optical characteristics of a projection optical system by obtaining, by a prediction formula, a predicted value for a fluctuation amount of the optical characteristics relative to an exposure period of a substrate via the projection optical system, the method comprising determining the prediction formula by using a dedicated pattern in which a plurality of marks are arranged in a matrix on an object plane of the projection optical system, wherein the determining includes selecting, from the plurality of marks, at least two marks located in an illuminated region to be formed on the object plane when exposing the substrate, and obtaining the prediction formula based on positions of images of the at least two marks formed on an image plane of the projection optical system.

Evaluation method, storage medium, exposure apparatus, exposure method, and method of manufacturing article

An exposure apparatus includes: a projection optical system; an adjusting unit configured to adjust imaging characteristics of the projection optical system; and a controller configured to divide the plurality of shot regions into groups based on data of a shift in the pattern of each shot region and an order of the exposure, determine setting amounts of the imaging characteristics for each group, and control the adjusting unit to set the imaging characteristics to the setting amounts for each group. The setting amount is common to a plurality of shot regions in the group and varies among the groups. The controller performs the division such that the shot regions belonging to the same group have a sequential exposure order and all values of the shift in the shot regions belonging to the same group fall within a predetermined range.

Exposure apparatus, exposure method, and device manufacturing method

A position detector configured to detect a position of an object to be detected. The position detector has an optical system configured to detect a mark on the object to be detected that includes a lens that has a positive refractive power, and a reflection member configured to reflect a light flux that passes through the lens in a convergent state or a divergent state. The reflection member is configured from at least one material of a material that exhibits a refractive index of less than 1.0 and an extinction coefficient of greater than 0.0, and a material that exhibits a refractive index of greater than 1.0 and an extinction coefficient of greater than 0.5.

Position detector, lithography apparatus, and device manufacturing method

The present invention provides an exposure apparatus which exposes a substrate, the apparatus including an adjustment unit configured to adjust an oxygen concentration in a space between the projection optical system and the substrate, a measuring unit configured to measure an illuminance of light applied to the substrate, and a control unit configured to control the measuring unit so as to measure illuminances of light applied to the substrate a plurality of times during irradiation of the substrate with light from the projection optical system, configured to calculate, based on each of the illuminances measured the plurality of times, an oxygen concentration value corresponding to the measured illuminance on each time and configured to control the adjustment unit so as to set the oxygen concentration in the space to the calculated oxygen concentration value.

Exposure apparatus and method of device fabrication

The present invention provides an exposure apparatus which expose a substrate, the apparatus including an illumination optical system configured to illuminate a mask using light from a light source, a projection optical system configured to irradiate the substrate with light from a pattern on the mask, an adjustment unit configured to adjust an oxygen concentration in a space between the projection optical system and the substrate, an obtaining unit configured to obtain data of illuminance of light applied to the substrate, and a control unit configured to control the adjustment unit so as to set the oxygen concentration in the space to a predetermined concentration value based on the data of illuminance obtained by the obtaining unit.

Exposure apparatus and device fabrication method

The present invention provides a measurement apparatus which measures a height of a test surface, the apparatus including an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the test surface and reference light from a reference surface, and an optical system configured to guide measurement light beams, reflected at a plurality of measurement points on the test surface, and reference light beams, reflected at a plurality of reference points on the reference surface, to the plurality of detection units, respectively, wherein the reference surface generates differences among optical path differences between the measurement light beams and the reference light beams which enter the plurality of detection units, respectively.

Measurement apparatus for calculation of substrate tilt, exposure apparatus, and device fabrication method

An exposure apparatus and a fabrication method thereof include an obtaining unit configured to obtain data of a first imaging position at which light from a first pattern having, as a longitudinal direction thereof, a first direction perpendicular to an optical axis of a projection optical system forms an image via the projection optical system, and data of a second imaging position at which light from a second pattern having, as a longitudinal direction thereof, a second direction which is not parallel to the first direction and is perpendicular to the optical axis forms an image via the projection optical system, when the first pattern and the second pattern are respectively placed on an object plane of the projection optical system, and a control unit configured to control a stage so that a substrate is positioned at a target position of the substrate along the optical axis.

An apparatus includes a system configured to split a light emitted from a light source into reference light and subject light, cause the subject light to enter into an object, and combine the subject light reflected by the object with the reference light, a detection unit configured to detect coherent light between the combined subject and reference lights, an element, provided within a light path of the reference light or the subject light, configured to change a path length difference between the reference light and the subject light and a relative position between the reference light and the subject light in a light receiving surface of the detection unit, and a position-variable mechanism configured to cause a position of the optical element to be changeable, wherein, by changing a position of the element, the optical path length difference and the relative position are independently adjusted.

Measuring apparatus and exposure device

An interferometer measures a displacement of an object to be measured by observing a fluctuation in intensity of interfering light generated by dividing light emitted from a light source into two light beams and overlaying the two light beams. The interferometer includes: a light-receiving unit including a light-receiving area including a plurality of partial areas and configured to detect the interfering light in each of the plurality of partial areas; and a processing unit configured to calculate a value of an index indicating uniformity of a phase distribution of the interfering light in the light-receiving area by using a detection result in each of the partial areas.

Interferometer

The present invention provides an exposure apparatus including an obtaining unit configured to obtain data of a first imaging position at which light from a first pattern having, as a longitudinal direction thereof, a first direction perpendicular to an optical axis of a projection optical system forms an image via the projection optical system, and data of a second imaging position at which light from a second pattern having, as a longitudinal direction thereof, a second direction which is not parallel to the first direction and is perpendicular to the optical axis forms an image via the projection optical system, when the first pattern and the second pattern are respectively placed on an object plane of the projection optical system, and a control unit configured to control a stage so that a substrate is positioned at a target position of the substrate along the optical axis.

The present invention provides a measurement apparatus which measures a height of a test surface, the apparatus including an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the test surface and reference light from a reference surface, and an optical system configured to guide the measurement light and the reference light to the plurality of detection units, wherein the reference surface is placed such that differences are generated among optical path differences between measurement light beams and reference light beams which enter the plurality of detection units, respectively.

Height measurement apparatus, exposure apparatus, and device fabrication method

The present invention provides a measuring apparatus which measures a shape of a surface of a measurement target object, comprising a light projecting optical system configured to split light from a light source into measurement light and reference light so that the measurement light enters the surface of the measurement target object and the reference light enters a reference mirror, a light receiving optical system configured to guide the measurement light reflected by the surface of the measurement target object and the reference light reflected by the reference mirror to a photoelectric conversion device, and a processing unit configured to calculate the shape of the surface of the measurement target object based on an interference pattern which is detected by the photoelectric conversion device and formed by the measurement light and the reference light.

Measuring apparatus, exposure apparatus, and device fabrication method

A wafer surface level detection method includes a first level measurement step of measuring a level of a surface of a substrate having a plurality of shot regions, a position measurement step of measuring a position along the surface of the substrate, a first movement step of moving the substrate in at least a vertical direction on the basis of the measurement result obtained in the first level measurement step and the measurement result obtained in the position measurement step, and a second level measurement step of measuring the level of the surface of the substrate after the first movement step, wherein each of the plurality of shot regions has a measurement region. In the first movement step, the substrate is moved such that a relative position of the measurement region of each of the plurality of shot regions and each of the plurality of shot regions along the surface is constant, and, in the second level measurement step, the measurement region of each of the plurality of shot regions is measured.

Surface level detection method, exposure apparatus, and device manufacturing method

A shape measuring method for measuring a surface shape of a measurement target includes dividing light from a light source into measurement light and reference light, the measurement light being obliquely incident upon a surface of the measurement target, the reference light being incident upon a reference mirror, introducing the measurement light reflected by the measurement target and the reference light reflected by the reference mirror to a photoelectric conversion element, detecting interference light formed by the measurement light and the reference light by the photoelectric conversion element while moving the measurement target, and measuring the surface shape of the measurement target based on an interference signal obtained from the measurement light that has been reflected at the same position on the surface of the measurement target.

Growing community of inventors

Utsunomiya, Japan

Ryo Sasaki