Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Ryo Kuwabara

Atsushi Yamaguchi

Hidenori Miyakawa

Koso Matsuno

Hiroe Kowada

Yoshio Okayama

Masahiro Ono

Yusuke Mori

Naomichi Ohashi

Kimiaki Nakaya

Mamoru Imade

Tomio Yamashita

Hideyuki Tsujimura

A method and apparatus for producing a Group III nitride in which the thermal decomposition of the nitrogen element-containing gas is suppressed to enhance the productivity. The method for producing a Group III nitride crystal, comprising: reacting an oxide or a metal of a Group III element under a heated atmosphere to form a compound gas of the Group III element; mixing a nitrogen element-containing gas at a temperature that is lower than that of the compound gas, with the compound gas; and reacting the nitrogen element-containing gas with the compound gas to form a Group III nitride crystal.

Method for producing group III nitride crystal

An electronic moduleincludes: a circuit boardhaving a first surface and a second surface opposite the first surface; and a plurality of electronic componentsmounted thereon. The electronic componentsare sealed at the first surface of the circuit board, with a mold bodycomposed of a resin composition. A shield layeris formed on the surface of the mold body. The glass transition temperature of a resin included in the mold bodyis higher than the glass transition temperatures of resins included in the circuit boardand the shield layer, respectively. The modulus of elasticity of the mold body at 25&#xb0; C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

Electronic module and production method therefor

A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity &#x3b7;and a thixotropy index Tat a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity &#x3b7;and a thixotropy index Tso that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30&#x2266;&#x3b7;&#x2266;300 (Pa&#xb7;s) and 3&#x2266;T&#x2266;T&#x2266;7, and sectional area Sof the first adhesive part and sectional area Sof the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S&#x2266;S

Mounting structure of semiconductor package component and manufacturing method therefor

A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.

Package structure

A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 &#x3bc;m, and the second filler has a largest particle size of 1 to 100 &#x3bc;m, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.

Surface mount adhesive, mounting structure including the same, and method for producing mounting structure

A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.

Growing community of inventors

Osaka, Japan

Ryo Kuwabara