Nichia Corporation

Daicel Corporation

Ryo Itaya

Yasunobu Nakagawa

Shinya Yabuno

Shigeaki Kamuro

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components:

Curable resin composition, cured product of same and semiconductor device

An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula:(SiO)(RSiO)(RSiO)(RSiO)wherein each Ris alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R, and a1&#x3e;0, a2&#x3e;0, a3&#x2265;0, a4&#x3e;0, 0.5&#x2264;a1/a2&#x2264;10, and a1+a2+a3+a4=1;(B) a polyorganosiloxane represented by the following average composition formula:RHSiOwherein Ris alkyl or aryl, and 0.7&#x2264;m&#x2264;2.1, 0.001&#x2264;n&#x2264;1.0, and 0.8&#x2264;m+n&#x2264;3; and(C): a hydrosilylation catalyst.

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Ohtake, Japan

Ryo Itaya