Harima Chemicals, Incorporated

The Furukawa Electric Co., Ltd.

Ryo Inoue

Masanao Kono

Yasutaka Nishi

Shinsuke Ohara

Yoshihiro Hasegawa

Tatsuji Mizuta

Yasuyoshi Sanada

Takao Fukunaga

Kenzo Kobayashi

Hisao Irie

Hisao Nakajima

A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.

Solder precipitating composition

A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the metal salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the field of electronic industry.

Method for the manufacture of electronic circuits utilizing a

A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the melt salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in the normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the electronic industry field.

Conductive high molecular weight composition

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Himeji, Japan

Ryo Inoue