Ibiden Company Limited

Ibigawa Electric Industry Co., Ltd.

Ibiden Kabushiki Kaisha

Tohoku University

Ibide Co., Ltd.

Ibiden Corporation

Ryo Enomoto

Masaya Yamada

Yoshimi Matsuno

Motoo Asai

Yasuji Hiramatsu

Kiyotaka Tsukada

Masato Yokoi

Takao Yokoyama

Masanori Tamaki

Hidetoshi Yamauchi

Yasumitsu Miyazaki

Mitihiro Yoshioka

Yoshiki Sugiyama

Kunio Kato

Shoji Tanikawa

Tadahiro Ohmi

Takashi Kariya

Akihiro Morimoto

Hajime Sakamoto

Kenzo Hatada

Hideo Yabashi

Tadashi Sugiyama

Yutaka Iwata

Akihiro Demura

Satoshi Ohno

Kazuhisa Hara

Yoshikazu Sakaguchi

Akihito Nakamura

Hiroyuki Tanaka

Michihiro Yoshioka

Toshikazu Amino

For the purpose of providing a semiconductor element built-in type multilayered circuit board in which a semiconductor element is closely joined to a recess of an insulating substrate to effectively disperse heat generated from the semiconductor element through the insulating substrate at a working temperature region of the semiconductor element circuit board, to surely conduct an electrical connection of an electronic part such as semiconductor element or the like in a short wiring and to enable the high density mounting of semiconductor elements, miniaturization and increase of working speed, there is proposed a semiconductor element built-in type multilayered circuit board formed by laminating a plurality of semiconductor element built-in type boards each comprising an insulating substrate and a semiconductor element accommodated in a recess formed therein, characterized in that a difference between a linear expansion coefficient of the insulating substrate and a linear expansion coefficient of the semiconductor element in a temperature zone of 20-300&#xb0; C. is less than 1&#xd7;10/K.

Multilayered circuit substrate with semiconductor device incorporated therein

A substrate includes a inorganic material base board has a recess and at least one penetration hole provided around the recess, and a semiconductor device accommodated in the recess and including at least one electrode pad provided on a surface of the semiconductor device. A resin filling is provided in the at least one penetration hole and has at least one through-hole for electrically connecting a top surface and a back surface of the resin filling. An insulating layer covers the surfaces of the semiconductor device, the resin filling and the inorganic material base board and has a first opening corresponding to the at least one through-hole and a second opening corresponding to the at least one electrode pad. A conductive wiring is formed on a surface of the insulating layer for electrically connecting the at least one through-hole and the at least one electrode pad.

Substrate and multilayer circuit board

Holes () are formed with a laser beam through an insulating substrate () on which a metallic layer () is formed and via holes () are formed by filling up the holes () with a metal (). After the via holes () are formed, a conductor circuit () is formed by etching the metallic layer () and a single-sided circuit board (A) is formed by forming projecting conductors () on the surfaces of the via holes (). The projecting conductors () on the circuit board (A) are put on the conductor circuit () of another single-sided circuit board (B) with adhesive layers () composed of an uncured resin in-between and heated and pressed against the circuit (). The projecting conductors () get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (). Since single-sided circuit boards (A,B,C, andD) can be inspected for defective parts before the boards (A,B,C, andD) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

Method for manufacturing single sided substrate

By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled conductive paste under the condition of reduced pressure, removing air bubble strapped in the conductive paste.

Method of manufacturing printed-circuit board

Each via hole of a printed wiring board is filled with a metal conductor. A distal end of each metal conductor is covered with a diffusing metal layer. The distal end of the metal conductor is pressed against a conductor circuit of another substrate, and the printed wiring boards are bonded together by thermocompression bonding. The metal of the distal end of each metal conductor is diffused into the metal of the conductor circuit so that an alloy layer is formed in an interface. As a result, reliability in the interlayer electrical connection can be improved.

Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof

Holes ( ) are formed with a laser beam through an insulating substrate ( ) on which a metallic layer ( ) if formed. After the holes ( A) are formed, via holes ( ) are formed by filling up the holes ( ) with a metal ( ) and a conductor circuit ( ) is formed by etching the metallic layer ( ). Then, a single-sided circuit board ( A) is formed by forming projecting conductors ( ) on the surfaces of the via holes ( ). The projecting conductors ( ) of the circuit board ( A) are put on the conductor circuit ( ) of another single-sided circuit board ( B) with adhesive layers ( ) composed of an uncured resin in between and heated and pressed against the circuit ( ). The projecting conductors ( ) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit ( ). Since single-sided circuit boards ( A, B, C, and D) can be inspected for defective parts before the boards ( A, B, C, and D) are laminated upon another, only defectless single-sided circuit boards can be used in the step of lamination.

Multilayer printed wiring board and method for manufacturing the same

Holes ( ) are formed with a laser beam through an insulating substrate ( ) on which a metallic layer ( ) is formed and via holes ( ) are formed by filling up the holes ( ) with a metal ( ). After the via holes ( ) are formed, a conductor circuit ( ) is formed by etching the metallic layer ( ) and a single-sided circuit board ( A) is formed by forming projecting conductors ( ) on the surfaces of the via holes ( ). The projecting conductors ( ) on the circuit board ( A) are put on the conductor circuit ( ) of another single-sided circuit board ( B) with adhesive layers ( ) composed of an uncured resin in-between and heated and pressed against the circuit ( ). The projecting conductors ( ) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit ( ). Since single-sided circuit boards ( A, B, C, and D) can be inspected for defective parts before the boards ( A, B, C, and D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

Single-sided circuit board and method for manufacturing the same

A via is formed by copper plating on a surface of an aluminum electrode pad of a semiconductor chip . Since the via having flexibility absorbs a stress generated due to a difference in thermal expansion between the semiconductor chip and a substrate, the semiconductor chip can be mounted onto the substrate with high reliability and connection reliability of the semiconductor chip can be enhanced.

Semiconductor chip and method manufacturing the same

A single-sided circuit substrate for a multilayer printed writing board has an insulating hard substrate, a conductor circuit formed on a surface of the substrate, an adhesive layer formed on the other surface, and at least one viahole through the substrate and the adhesive layer so as to pass these layers and contact with the conductor. The viaholes are filled with conductive paste. The invention also provides a multilayer printed wiring board having an IVH structure constituted with single-sided circuit hard substrates and a method of efficiently manufacturing the same with high yield.

One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production

An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.

Adhesive for electroless plating, printed circuit boards and method of

Improved printed wiring boards are disclosed, in which indications showing the types of electronic devices to be mounted on the printed wiring boards and other information are provided within the insulation cover coating and are protected from getting accidentally scraped off. Alignment marks are also well protected so that users can always rely on the alignment marks. The surfaces of the printed wiring boards are smooth and flat, which prevents stagnation trouble in a feeding operation of the printed wiring boards as well as helps provide a securer mounting of electronic devices. An improved wiring freedom is also provided.

Printed wiring board having indications thereon covered by insulation

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Superconductive ceramic wire and method for producing the same

A method for producing a second harmonic wave generating device comprises the steps of:

Method for producing a second harmonic wave generating device

Lithium niobate single crystal thin film and production method thereof

Growing community of inventors

Gifu, Japan

Ryo Enomoto