Honeywell International Inc.

Ryan Supino

Robert D Horning

Burgess R Johnson

Eugen I Cabuz

Alan Bruce Touchberry

Rajeev Mohan

Grant Lodden

Douglas Mark Weed

Howard B French

Vijay Kumar Shrimal

Bob D Horning

Mohan Singh Tomar

Grant H Lodden

Techniques are disclosed for providing at least one proposed alternative plan of travel of a vehicle are disclosed based upon data of at least one geographic region about at least one of global navigation satellite system (GNSS) spoofing and GNSS jamming. If a current path of travel of the vehicle intersects at least one geographic region of at least one of GNSS spoofing and GNSS jamming, then determining the at least one proposed alternative plan of travel of the vehicle. At least one of the at least one proposed alternative plan of travel includes a path of travel that does not intersect at least one geographic region of the at least one geographic region of at least one of GNSS spoofing and GNSS jamming. The determined at least one proposed alternative plan of travel is sent to the vehicle.

Systems and methods to provide real-time context-based avoidance mechanisms for GNSS jamming or spoofing regions

An all-silicon electrode capacitive transducer comprising: a movable silicon microstructure coupled to a glass substrate, the movable silicon microstructure having a movable silicon electrode, the glass substrate having a top surface and at least one recess, the movable silicon electrode having a first flat surface parallel to a plane of the top surface of the glass substrate, the movable silicon electrode having a first electronic work function; and a stationary silicon electrode coupled to a glass substrate, the stationary silicon electrode located adjacent to the movable silicon electrode, the stationary silicon electrode configured to sense or actuate displacement of the movable silicon microstructure, wherein the stationary silicon electrode has a second flat surface parallel to the first flat surface, the stationary silicon electrode having a second electronic work function equal to the first electronic work function.

All-silicon electrode capacitive transducer on a glass substrate

A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.

MEMS vertical comb structure with linear drive/pickoff

In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

Vibration isolation interposer die

Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

Systems and methods for a three-layer chip-scale MEMS device

Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.

Two degree of freedom dithering platform for MEMS sensor calibration

Systems and methods for two degree of freedom dithering for micro-electro-mechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.

Systems and methods for an encoder and control scheme are provided. In one embodiment, a micro-electromechanical system (MEMS) device comprises: a stator having a first marker and a second marker arranged on a surface of the stator to form a sensing pattern; a sweeping element that dithers in a plane parallel to the surface of the stator along a sweep path that crosses the first marker and a second marker; an overlap sense circuit operable to measure an area overlap between the sweeping element and the sensing pattern, wherein the overlap sense circuit generates a pulse train signal output that varies as a function of the area overlap.

Systems and methods for an encoder and control scheme

A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.

MEMS sensor using multi-layer movable combs

In an embodiment a method of fabricating a MEMS structure is provided. The method includes fabricating a working structure in a doped layer proximate a first surface of a silicon substrate. The first surface of the silicon substrate is bonded to a first planar glass structure having a first one or more sacrificial features embedded therein. The method also includes etching to remove a bulk of the silicon substrate, wherein the bulk is reverse of the first surface on the silicon substrate, wherein etching removes the bulk and leaves the working structure bonded to the first planar glass structure. The method also includes etching to remove the first one or more sacrificial features from the first planar glass structure.

Methods for fabricating MEMS structures by etching sacrificial features embedded in glass

A method for calibrating a micro-electro-mechanical system (MEMS) vibrating structure gyroscope is provided. The method includes obtaining an indication of a position of at least one proof mass with respect to at least one drive electrode and applying an electrostatic force to the at least one proof mass as a function of the indication, the electrostatic force configured to position the at least one proof mass in a first position with respect to at least one drive electrode.

Adjusting a MEMS gyroscope to reduce thermally varying bias

A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.

Method of personal navigation using stride vectoring

A Micro-Electro-Mechanical Systems (MEMS) inertial sensor systems and methods determine linear acceleration and rotation in the in-pane and out-of-plane directions of the MEMS inertial sensor. An out-of-plane linear acceleration of the MEMS sensor may be sensed with the first out-of-plane electrode pair and the second out-of-plane electrode pair. An in-plane rotation of the MEMS sensor may be sensed with the first out-of-plane electrode pair and the second out-of-plane electrode. An in-plane linear acceleration of the MEMS sensor may be sensed with the first in-plane sense comb and the second in-plane sense comb. An out-of-plane rotation of the MEMS sensor may be sensed with the first in-plane sense comb and the second in-plane sense comb.

Systems and methods for acceleration and rotational determination from an in-plane and out-of-plane MEMS device

A Micro-Electro-Mechanical Systems (MEMS) inertial sensor systems and methods are operable to determine linear acceleration and rotation. An exemplary embodiment applies a first linear acceleration rebalancing force via a first electrode pair to a first proof mass, applies a second linear acceleration rebalancing force via a second electrode pair to a second proof mass, applies a first Coriolis rebalancing force via a third electrode pair to the first proof mass, applies a second Coriolis rebalancing force via a fourth electrode pair to the second proof mass, determines a linear acceleration corresponding to the applied first and second linear acceleration rebalancing forces, and determines a rotation corresponding to the applied first and second Coriolis rebalancing forces.

Systems and methods for acceleration and rotational determination from an out-of-plane MEMS device

A ground contact switch system comprises a first object configured to contact a ground surface during a stride, and one or more switches coupled to the first object. An inertial measurement unit can be coupled to the first object. The one or more switches are configured to detect when the first object is at a stationary portion of the stride. The one or more switches can also be configured to send a signal to activate an error correction scheme for the inertial measurement unit.

Growing community of inventors

Loretto, MN, United States of America

Ryan Supino