Nextinput, Inc.

Onscale, Inc.

Qorvo Us, Inc.

Joyson Safety Systems Acquisition LLC

Ansys, Inc.

Decawave Limited

Ryan Matthew Diestelhorst

Ian Campbell

Dan Benjamin

Julius Minglin Tsai

Scott McClennan

David M Freed

Joshua Oster-Morris

Jason Carl Lisseman

David Andrews

Ali Foughi

Don Metzger

Steven S Nasiri

Michael J Dueweke

Amnon Brosh

Michael Dueweke

Steven Nasiri

Jonathan McLaughlin

Laura Carcione

Josh Oster-Morris

Andy Tweedie

Gerald Harvey

Robbie Banks

Jeremy Crank

Kyle Kosic

Anil Sehgal

Jeff Dobson

Estimating the computational cost of simulation using a machine learning model. An example method includes inputting a feature data set into a machine learning model. The feature data set includes model geometry metadata and simulation metadata. The method further includes predicting, using the machine learning model, a computational cost characteristic for a simulation process.

Methods and systems for the estimation of the computational cost of simulation

An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.

Sealed force sensor with etch stop layer

Systems and methods for automated resource allocation during a computational simulation are described herein. An example method includes performing a simulation with a first set of computing resources. The method also includes dynamically analyzing at least one attribute of the simulation to determine a second set of computing resources for performing the simulation, and performing the simulation with the second set of computing resources. The second set of computing resources is different than the first set of computing resources.

Dynamic resource allocation for computational simulation

Systems and methods for automated resource allocation during a computational simulation are described herein. An example method includes analyzing a set of simulation inputs to determine a first set of computing resources for performing a simulation, and starting the simulation with the first set of computing resources. The method also includes dynamically analyzing at least one attribute of the simulation to determine a second set of computing resources for performing the simulation, and performing the simulation with the second set of computing resources. The second set of computing resources is different than the first set of computing resources.

An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

Integrated digital force sensors and related methods of manufacture

Described herein is a ruggedized microelectromechanical ('MEMS') force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor ('CMOS') circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

Integrated piezoresistive and piezoelectric fusion force sensor

Systems and methods are provided to move the solving of multi-physics engineering simulations away from specific CAE, or combination CAD and CAE, applications. In one embodiment, an Application Programming Interface (API) is provided that can be integrated into any device, system, application, or software workflow. The API exposes a series of functions or modules that a user can use to create a simulation file that includes parameters such as a model for the simulation, physics for the simulation, timings for the simulation, and other parameters. The simulation file may then be executed on one or more nodes of a cloud-based computer cluster, and the results of executing the simulation can be provided back to the user. The user may then visualize the results using their preferred device, software, application, or workflow.

Systems and methods for running a simulation

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor ('CMOS') circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

An example force sensitive touch panel device can include a device body; a touch surface for receiving a touch force; a sensor for sensing touch force that is arranged between the device body and the touch surface; and a membrane configured to mechanically isolate the device body and the touch surface. Additionally, the membrane can apply a preload force to the sensor.

Growing community of inventors

Sunnyvale, CA, United States of America

Ryan Matthew Diestelhorst