Agere Systems Inc.

Ryan Keith Maynard

Erik Cho Houge

John Martin McIntosh

Larry E Plew

Jeffrey Bruce Bindell

Michael J Antonell

Darrell L Simpson

Jennifer A Antonell

A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.

Chemical mechanical polishing of dual orientation polycrystalline materials

A probe comprising a probe body having a body longitudinal axis and a shoulder, and a microstylet mechanically coupled to the shoulder, and a method of manufacturing the same. The microstylet extends from the shoulder and has a microstylet longitudinal axis coincident the body longitudinal axis with the microstylet having a cross section substantially smaller than a cross section of the probe body.

Probe having a microstylet

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St. Cloud, FL, United States of America

Ryan Keith Maynard