Aptiv Technologies Limited

Aptiv Technologies Ag

Ryan K Rossiter

Jun Yao

Stephen William Alland

James F Searcy

Mingjian Li

Dennis C Nohns

Roberto Leonardi

Robert C Beer

George J Purden

Matthew S Carrell

An electromagnetic band-gap (EBG) structure includes an antenna substrate layer, first conductive regions, and second conductive regions. The antenna substrate includes a first planar surface and a second planar surface. The first conductive regions are located on the first planar surface of the antenna substrate and separated from adjacent first conductive regions by a first distance. The second conductive regions are located on the first planar surface of the antenna substrate and are separated from the first conductive regions by a second distance and wherein the second conductive regions at least partially surround the first conductive regions.

Electromagnetic band gap structure (EBG)

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

Transition formed of LTCC material and having stubs that match input impedances between a single-ended port and differential ports

Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports

A bi-static radar system configured for coherent detection of a radar-signal includes a plurality of radar-transceivers, a controller, and a communications device. The plurality of radar-transceivers is characterized as physically spaced apart with respect to each other. The controller is in communication with the each of the radar-transceivers and is configured to coherently operate each of the radar-transceivers. The communications device communicates both a reference-clock signal and a frame-sync signal from the controller to each of the plurality of radar-transceivers whereby the plurality of radar-transceivers operate coherently. Alternatively, the system may include a reference-signal generator, a transmitter, and a plurality of receivers. The reference-signal generator generates a reference-signal characterized by a reference-frequency proportional to a fraction of a radar-frequency of a radar-signal transmitted. The transmitter generates the radar-signal at the radar-frequency based on the reference-signal. The plurality of receivers operates coherently to detect the radar-signal based on the reference-signal.

Bi-static radar system

An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.

Signaling device including a slot transition between a substrate integrated waveguide and a signal generator

A radar unit includes a printed circuit board (PCB) supporting an integrated circuit (IC) chip. A radome is arranged over the IC chip. A spring engages the IC chip and the radome. The spring is configured to transfer thermal energy between the IC chip and the radome.

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Kokomo, IN, United States of America

Ryan K Rossiter