International Business Machines Corporation

Globalfoundries Inc.

Ryan Joseph Linderman

Thomas J Brunschwiler

Hugo Eric Rothuizen

Bruno Michel

Urs Kloter

Reto Waelchli

Reio Waelchli

The invention relates to a cooling arrangement comprising a heat spreader () comprising a first surface (), a second surface (), at least one heat absorption chamber () and at least one heat dissipation chamber (), the at least one heat absorption chamber () being in thermal contact with the first surface () and the at least one heat dissipation chamber () being in thermal contact with the second surface () and hydraulically coupled to the at least one heat absorption chamber (). A cooling fluid () can be driven from the heat absorption chamber () to the heat dissipation chamber () using a plurality of flow patterns for cooling the first surface ().

Method and device for cooling a heat generating component

The invention relates to an integrated circuit stack () comprising a plurality of integrated circuit layers () and at least one cooling layer () arranged in a space between two circuit layers (). The integrated circuit stack () is cooled using a cooling fluid () pumped through the cooling layer (). The invention further relates to a method for configuring of such an integrated circuit stack () by optimizing a configuration of the cooling layer ().

Integrated circuit stack

The invention relates to an integrated circuit stack () comprising a plurality of integrated circuit layers () and at least one cooling layer () arranged in a space between two circuit layers (). The integrated circuit stack () is cooled using a cooling fluid () pumped through the cooling layer (). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack ().

An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.

Cooling system for an electronic component system cabinet

A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.

Growing community of inventors

Pasadena, CA, United States of America

Ryan Joseph Linderman