Delta Design, Inc.

Uchicago Argonne, LLC

Ryan J Stoddard

Xing Chen

Jonathan L Herlocker

Matt McLaughlin

A method is disclosed for generating a corrective film pattern for reducing wafer bow in a semiconductor wafer fabrication process. The method inputs to a neural network a wafer bow signature for a predetermined semiconductor fabrication step. The neural network generates from the input a corrective film pattern corresponding to the wafer bow signature. The neural network is trained with a training dataset of wafer shape transformations and corresponding corrective film patterns.

Method for determining corrective film pattern to reduce semiconductor wafer bow

In some embodiments, a computer-implemented method of controlling a semiconductor manufacturing process is provided. A computing system generates predicted metrology values for a current run and a next run by providing metrology forecast inputs to a metrology forecast model. The computing system generates an updated recipe for executing at least one semiconductor manufacturing process step using the predicted metrology values for the current run and the next run.

Optimizing semiconductor manufacturing processes using machine learning

A system for defining structures within an image is described. The system includes reading of an input file, preprocessing the input file while preserving metadata such as scale information and then detecting features of the input file. In one version the detection first uses an edge detector followed by identification of features using a Hough transform. The output of the process is identified elements within the image.

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Seattle, WA, United States of America

Ryan J Stoddard