Honeywell Federal Manufacturing & Technologies, LLC

Ryan J Eickbush

Steven Michael Patterson

Christopher Scott Marchman

Nicholas J Furman

Neiko P Levenhagen

Ruben Arturo Pino

Bill Capen

Jason Bradley Edgar

Logan Thomas Walz

Daniel Benjamin Hartley

Jaime Eduardo Regis

A method may apply an ink layer in a desired pattern onto a substrate with a substrate coefficient of thermal expansion. A method may heat the ink layer and the substrate at a temperature increase ramp rate to a predefined target temperature for the ink layer, to obtain a metallic layer in substantially the desired pattern and with a metallic coefficient of thermal expansion. A method may cool the metallic layer and the substrate at a temperature decrease ramp rate, wherein a difference between the substrate coefficient of thermal expansion and the metallic coefficient of thermal expansion, in combination with the temperature increase ramp rate and the temperature decrease ramp rate, operates to completely delaminate the metallic layer from the substrate, thereby producing the patterned metallic foil.

Forming multi-layer foils using additive manufacturing delamination and accelerometer application

Systems and methods for testing platforms using additive manufacturing techniques. A testing platform may include an electrical device configured to maintain an electrical connection with one or more additional electrical devices. A testing platform may include one or more connection pads configured to establish a secondary electrical connection between the electrical device and an external testing system. A testing platform may include a testing pattern usable by the external testing system, the testing pattern comprising: one or more printed traces, the one or more printed traces formed from a material deposited via an additive manufacturing technique, wherein the one or more printed traces are located between the electrical device and the one or more additional electrical devices.

Additively manufactured printed electronics tester

Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Electronics module with raceway and submodules

A nozzle holder assembly for a three-dimensional printer comprises a mount, a printer nozzle, and a locking mechanism. The mount is operable to be secured to the three-dimensional printer. The printer nozzle shaft is movably coupled to the mount along a predetermined length. The locking mechanism is configured to fix the printer nozzle shaft relative to the mount at any position along the predetermined length.

Minimal contact slide for touch indication

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Grandview, MO, United States of America

Ryan J Eickbush