Juniper Networks, Inc.

Ryan Holmes

Domenico Di Mola

Zhen Qu

Steven B Alleston

Yang Yue

Jon J Anderson

Jeffery J Maki

Chul Soo Park

John B Kenney

Bo Mi

A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

External laser enabled co-packaged optics architectures

A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.

Power efficient and scalable co-packaged optical devices

A disclosed apparatus for accomplishing such a task may include (1) a circuit board incorporated into a module designed for insertion into slots of computing devices, (2) at least one conductive contact disposed on the circuit board, (3) a counter circuit disposed on the circuit board and communicatively coupled to the conductive contact, wherein the counter circuit comprises (A) a signal-change detector that detects signal changes as the module is inserted into one of the slots of the computing devices and (B) a counter device that maintains a dynamic count indicative of a number of times that the module has been inserted into one of the slots of the computing devices based at least in part on the signal changes, (4) a battery electrically coupled to the counter circuit, wherein the battery powers the counter device prior to the insertion. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for achieving accurate insertion counts on removable modules

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Nepean, Canada

Ryan Holmes