Meta Platforms Technologies, LLC

Ryan Fleming

Boyd Drew Allin

Cameron Peter Jue

Michael Pope

Rajat Mittal

Mark Shintaro Ando

Donghee Nam

Alexander Klement

Yi-Chen Kuo

Christopher Jon Kappler

Douglas Moskowitz

Kyung Won Park

Giti Karimi Moghaddam

Ray C He

A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Thermal management system for electronic device

A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Micro-OLED display module thermal management

The disclosed computer-implemented method may include detecting an amount of energy being discharged from a battery of a computing device. The method may further include predicting, based on the amount of energy being discharged from the battery, a thermal response of the computing device. Furthermore, the method may include performing thermal management of the computing device based on the predicted thermal response. Various other methods, systems, and computer-readable media are also disclosed.

Energy flow integration for a predictive virtual thermal sensor

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Oakland, CA, United States of America

Ryan Fleming