Amazon Technologies, Inc.

Ryan F Conroy

Felipe Enrique Ortega Gutierrez

Luke Thomas Gregory

Priti Choudhary

William Mark Megarity

Andrew Kent Warfield

Roey Rivnay

Ali Elashri

Christopher Mario Gil

Darren Ernest Canavor

Darin Lee Frink

Christopher Strickland Beall

Brendan Anthony Cully

Noah Thomas Kelly

Patrick Chow

Nicholas Mendenhall

Vikram Raghavan

Nicholas Paul Rush

Chetan Sanjay Agarwal

Travis Glover

Amy Margaret Curneen

Munish Sharma

Ryan Monaghan

Kallie Ryan

Patrick Conlon

A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

Limited blast radius storage server system

A robotic delivery vehicle may be capable of providing sufficient insulation for perishable items without sacrificing the delivery robotic delivery vehicles' travel range by using passive cooling configurations. Passive cooling configurations may include improving the insulation performance of the robotic delivery vehicle as well as incorporating cooling elements. The robotic delivery vehicle may include a cargo bay liner and a vehicle lid that covers and encloses a cargo bay from the external environment. The cargo bay liner may include an insulated bottom and at least one insulated wall extending from the insulated bottom, wherein the at least one insulated wall and the insulated bottom define a cargo volume. The lid may define a lid volume and is configured to selectively enclose the cargo volume.

Insulated cargo bay on robotic transport vehicle

Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.

Heat sinks for bare die multi-chip packages

A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.

Anti-sag modular server chassis assembly

A computing equipment box assembly can include a mechanical chassis component, which can include a support sheet configured for supporting computing components. A plurality of passages can be formed through the support sheet. A mechanical cable can be routable down through at least one of the passages and up through at least one other of the passages. A tensioner can be couplable with the cable and adjustable to modify an amount of tension in the cable so as to alter an amount of pre-bow or pre-bend present in the mechanical chassis component. For example, the mechanical cable may be tensioned to apply a force to the support sheet and counteract an upward pre-bend or pre-bow so that the computing components are prevented from protruding into an adjacent upper volume for an upper computer server overhead and from sagging into an adjacent lower volume for a lower computer server underneath.

Server chassis deflection driven by cable tensioning

A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.

Component ejection for fluid leak isolation

Embodiments herein describe a system for providing visual feedback to an associate when stowing packages into containers. As an associate carries a package towards a container, a camera disposed over the container captures an image of the package that a computer vision system uses to identify a barcode on the package. Using the barcode, the system can determine the desired destination of the package and whether the container the associate is approaching is the correct destination of the package. If so, the feedback system can activate a directional light on above the container which outputs a first color (e.g., green), thereby informing the associate that the container she is approaching is the correct container. However, if container is not the correct destination of the package, the directional light outputs a different color light (e.g., red) which informs the associate the container is the wrong destination for the package.

Method and system for identifying packages

A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.

Self-installing connections for rack liquid cooling

A datacenter component rack may be used to mount electronic components. The datacenter component rack may include support surfaces which are evenly spaced on each side of the component rack. The support surfaces may form uniform slots for receiving the electronic components. The electronic components may include flanges for mounting the electronic components in the uniform slots. The flanges may be on each side of the electronic component and engage the support surfaces in the datacenter component rack. The flanges may support the electronic component after they have engaged with the support surfaces.

Growing community of inventors

Seattle, WA, United States of America

Ryan F Conroy