Other

Daewon Semiconductor Packaging Industrial Company

Slack Technologies, Inc.

Ryan E Park

Matthew Whitlock

Athens Okoren

Sunna Chung

Leon Eric Atkinson

Robert P Jansen

R Patrick Johnson

John Kim

Jonathan Kevin Lie

Denny Kwon

Jin Chae

Bruce H Thompson

Noah Weiss

Jason Liszka

Joshua Wills

John Gallagher

Stanislav Vyacheslavovich Babourine

Shaun Sabo

Ananth Packkildurai

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Separators for handling, transporting, or storing semiconductor wafers

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Tape carrier assemblies having an integrated adhesive film

Methods, apparatus and computer program product for improving data indexing in a group-based communication platform are described herein. The group-based communication platform having a computed collection and one or more live collections. The computer-implemented method includes generating a new collection, the new collection being generated at a snapshot time point; associating a collection manager with the new collection; retrieving a plurality of electronic messages from the computed collection and the one or more live collections; writing the plurality of electronic messages to the new collection, the writing being completed at a cut-over time point; synchronizing the new collection with the one or more live collections based on the plurality of electronic messages; and redirecting the read alias and the write alias from the computed collection to the new collection.

Method, apparatus and computer program product for improving data indexing in a group-based communication platform

A wireless wiring apparatus includes a ceiling-embedded casing and a power-receiving casing. The ceiling-embedded casing includes screws connected to a surface of the ceiling-embedded casing and configured to be connected to a ceiling, a bracket inside the ceiling-embedded casing and connected to the screws, a coil, and a power wire connected to an external alternating current electrical power source. The power-receiving casing includes neodymium magnets on another surface of the power-receiving case, L-shaped notches formed adjacent to the neodymium magnets, and a coil of wire formed inside the power-receiving casing.

Electronic lighting apparatus with wireless connectability to a base for wireless power transmission and secure mounting with loaded spring for easy connection and release

Electronic lighting apparatus with wireless connectability to a base for wireless power transmission and secure mounting

A compact package for a garment made from a delicate material includes a container body having a volume of less than 10 in(164 cm), a delicate material garment, a cover member and a cap. The cover member is inserted into the container body atop the garment, followed by the cap. Preferably, a buffer material is arranged between the garment and the cover member within the container body to protect the garment from damage during the packing process. The package is preferably produced by directing the garment and buffer material into a pre-loading tube, followed by shifting of a plunger member to load the container body with the garment, buffer material and the cover member. Subsequently, the cap is snap-fit upon the container body.

Compact packaging for garments made from delicate materials

A compact package for a garment made from a delicate material includes a container body having a volume of less than 10 in (164 cm ), a delicate material garment, a cover member and a cap. The cover member is inserted into the container body atop the garment, followed by the cap. Preferably, a buffer material is arranged between the garment and the cover member within the container body to protect the garment from damage during the packing process. The package is preferably produced by directing the garment and buffer material into a pre-loading tube, followed by shifting of a plunger member to load the container body with the garment, buffer material and the cover member. Subsequently, the cap is snap-fit upon the container body.

Compact garment packaging

Growing community of inventors

Herrlman, UT, United States of America

Ryan E Park