Lightmatter, Inc.

Ryan Braid

Nicholas Christopher Harris

Darius Bunandar

Michael Gould

Carl Ramey

Mykhailo Tymchenko

Thomas Graham

Shashank Gupta

Anthony Kopa

Carlos Dorta-Quinones

James Carr

Nathaniel Bowman

Joseph Stadolnik, Iii

Karl C Buckenmaier

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.

Photonic communication platform and related circuits

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Photonic communication platform

Growing community of inventors

Cambridge, MA, United States of America

Ryan Braid