The University of Texas System

Keck Graduate Institute

Sandia Corporation, Operator of Sandia National Laboratories

Other

Sandia Corporation

Espalin, David

Ryan B Wicker

David Espalin

Eric MacDonald

Francisco Medina

Danny W Muse

Christopher Elkins

Jeremy A Palmer

Bart D Chavez

Alfonso Fernandez

Phillip L Gallegos

Brenda K Mann

Lawrence Eugene Murr

Luis A Ochoa

Jorge Mireles

Don W Davis

Rodolfo Salas

Karina Arcaute

Philip Alexander Morton

Chi Yen Kim

Donald W Davis

Buzuayehu Tedla

Ralph Felice

Hunter Taylor

Cesar A Terrazas-Najera

Sara Gaytan

Frank Medina

Mohammad Hossain

Isaac Varela

Chiyen Kim

Daniel Marquez

Alejandro Hinojos

Charlie Sullivan

Syed Zia Uddin

Jose Motta

Jorge Ramirez

A method of measuring spectral emissivity of materials is provided. The method comprises placing material in a controlled chamber and exposing the material to an energy source to heat the material. At least one multi-wavelength pyrometer measures the spectral emissivity of the material produced by heating by the energy source, wherein the multi-wavelength pyrometer is positioned at a distal end of a tube extending from the chamber, wherein the tube provides a sacrificial surface for vapor condensation to prevent the vapor condensation from obscuring a view port used by the pyrometer.

Spectral emissivity and temperature measurements of metal powders during continuous processing in powder bed fusion additive manufacturing

A test artifact for additive manufacturing is provided. The artifact comprises an additively manufactured singular continuous body between 100 cc and 6 cc in bounding box volume and between 50 cc and 3 cc in solid body. The body comprises at least three fiducials positioned for identification of locations in cross-section after sectioning of the artifact and at least three geometries that are unique from each other when exposed in cross section.

Metal additive manufacturing qualification test artifact

A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

Wire embedding system with a curved delivery path

A method of forming a crack-free aluminum alloy structure using additive manufacturing is presented. A powder bed of precursor aluminum alloy powder is heated. The crack-free aluminum alloy structure is formed within a laser powder bed fusion system encompassing the powder bed during heating.

Method and system for powder bed fusion additive manufacturing of crack-free aluminum alloys

A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

Methods and apparatus for embedding a wire intermittently

A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

Metal objects spanning internal cavities in structures fabricated by additive manufacturing

Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.

Structurally integrating metal objects into additive manufactured structures

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.

In-situ diagnostics and control method and system for material extrusion 3D printing

Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

Methods for connecting inter-layer conductors and components in 3D structures

Methods and systems comprise new design procedures that can be implemented for additive manufacturing technologies that involve evaluation of stress concentration sites using finite element analysis and implementation of scanning strategies during fabrication that improve performance by spatially adjusting thermal energy at potential failure sites or high stress regions of a part.

Method and system for producing functionally graded structures in powder bed fusion processing

An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.

Apparatus for wire handling and embedding on and within 3D printed parts

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.

Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices

Growing community of inventors

El Paso, TX, United States of America

Ryan B Wicker