Freescale Semiconductor,inc.

Ruzaini B Ibrahim

Kong Bee Tiu

Chee Seng Foong

Wai Yew Lo

Seng Kiong Teng

Wen Shi Koh

Aminuddin Ismail

Mohd Rusli Ibrahim

Nor Azam Man

A semiconductor device includes a lead frame, and an integrated circuit die. The lead frame has a flag for supporting the die and leads that surround that flag and die. The lead frame also has ground ring that surrounds the flag and die. First bond wires electrically connect the die to the lead frame leads. An insulating layer is disposed on the ground ring, and a power layer is disposed on the insulating layer. The semiconductor device further includes second bond wires that connect the die to the ground ring and third bond wires that connect the die to the power layer.

Semiconductor device with combined power and ground ring structure

A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

Heat spreader for integrated circuit device

A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and then multiple cuts are made to the lead frame to form the rows of external contacts.

Quad flat semiconductor device with additional contacts

A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat spreader. The film with the attached heat spreader is placed in a first mold section. A substrate having a semiconductor die attached and electrically coupled to it are placed in a second mold section and then the first and second mold sections are mated such that the die is covered by the heat spreader. The granular mold compound is then melted so that the mold compound covers the die and sides of the heat spreader. The first and second mold sections then are separated. The film, which adheres to the substrate, is removed to expose a top surface of the heat spreader, and thus a semiconductor device is formed.

Method of assembling semiconductor device with heat spreader

A method of packaging a semiconductor die () includes providing a flip-chip die () with bump connections () on its bottom surface (). An adhesive tape () is attached to a plate surface () and lead fingers () are formed on the tape (). The die () is placed on the tape () such that the bumps () on the die () contact respective ones of the lead fingers () on the tape (). A reflow process is performed on the die (), the tape () and the plate (), which forms C5 type interconnects. A mold compound () is formed over the die () and the tape (), and then the tape () and the plate () are removed.

Growing community of inventors

Bandar Puncak Alam, Malaysia

Ruzaini B Ibrahim