Analogic Corporation

Other

Ruvin Deych

John M Dobbs

Martin Choquette

Daniel Abenaim

Randy Luhta

Christopher David Tibbetts

Lane Marsden

Jeffrey Greenwald

Andrew Litvin

Ben Tuval

Vladan Ristanovic

Carl R Crawford

Ram Naidu

Bernard M Gordon

David A Schafer

James R Bowers

Charles H Shaughnessy

Christopher C Ruth

Chris Vrettos

David Banks

Oscar Khutoryansky

Peter M Howard

Remus M Braescu

Iouri Bachilov

Steve Urchuk

A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Detector array for a radiation system, and related system

A detector array is provided for detecting radiation photons. The detector array includes a phosphor screen that converts radiation photons into light energy. The detector array includes a photodiode array having a plurality of photodiodes that convert the light energy into electrical charge. A first photodiode of the plurality of photodiodes is spaced apart from a second photodiode of the plurality of photodiodes to define a non-detection region. The phosphor screen overlies the first photodiode, the second photodiode, and the non-detection region between the first photodiode and the second photodiode.

Detector array for imaging modality

A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.

Detector array for radiation imaging modality

Among other things, a detector array () for a radiation imaging system is provided. The detector array comprises a plurality of detector elements. Respective detector elements comprise, among other things, a scintillator () and a photodetector (). In some embodiments, a scintillator is shared amongst two or more of the detector elements. In some embodiments, little to no reflective material, configured to mitigate cross-talk between detector elements, is situated between two or more detector elements.

Indirect conversion detector array

The present disclosure includes multiple ways of providing photodetector interconnectivity using, for example: a) single-layered thick or thin film ceramic substrate to change a node pitch from one facing to another, and/or b) direct bonding of photodiode circuit to a flex cable interconnect.

Detection system and detector array interconnect assemblies

Detector array for radiation system

Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

Radiation detector system of radiation imaging modality

One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

Three-dimensional metal printing

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Detector unit for detector array of radiation imaging modality

Anti-scatter plates are used to attenuate secondary radiation so that it is not detected by a detector array. However, anti-scatter plates often cast dynamic shadows on the detector array which results in noise in signals produced by the detector array. As disclosed herein, an anti-scatter grid comprises at least two anti-scatter plates. A percentage difference in the shadows cast by the first and the second anti-scatter plates is substantially zero (e.g., causing uniform percentage change in shadows cast on the detector array). Additionally, the shadows that are cast by the anti-scatter plates may be substantially static. In one embodiment, this is accomplished by having a top surface of an anti-scatter plate that has a transverse dimension that is less than a bottom surface of the anti-scatter plate.

Anti-scatter grid or collimator

One or more techniques and/or systems described herein provide for a detector array having an effective size that is larger than its actual size of its elements, thus reducing costs by reducing materials required. In one embodiment, one or more channels of the detector array are removed (e.g., and filled with a radiation absorbing material) to create what may be referred to as a sparse array. In another embodiment, one or more channels of a detector array comprise a detection portion and a dead space (e.g., filled with a radiation absorbing material). In yet another embodiment, one or more channels of a detector array comprise light focusing mechanisms configured to focus light from a scintillator portion of an indirect conversion detector array to a photodetector portion of the detector array, where a detection surface area of the photodetector is less than a detection surface area of the scintillator.

Detector array having effective size larger than actual size

Among other things, one or more systems and/or techniques for integrating electrical charge yielded from an indirect conversion detector array of a pulsating radiation system are provided. The integration begins during a resting period between a first and second pulse and ends before the second pulse is emitted. Electrical charge that is measured during a resting period is integrated, while electrical charge measured during a pulse is not integrated. In this way, parasitic contributions caused by the direct interaction of radiation photons with a photodiode are reduced and a quantum efficiency of the indirect conversion detector array is increased, for example. Moreover, the period of integration can be adjusted such that a voltage gain related to the indirect conversion detector array can be varied to a predetermined level.

X-ray detector with improved quantum efficiency

An x-ray detector assembly includes a first substrate and a second substrate. An array of photodetectors, which have coplanar contacts, are disposed on the top surface of the first substrate. The x-ray detector assembly further includes a plurality of x-ray scintillator elements arranged in an array. The photodetectors are aligned so as to match the array of x-ray scintillator elements. The second substrate is fused to the bottom surface of the first substrate. The second substrate provides on its distal side a planar connectivity pattern matched to electronics of a signal acquisition system. One or more through-hole connections traverse both substrates, and are configured to couple the contacts of the photodetectors from the top surface of the first substrate to the connectivity pattern on the distal side of the second substrate.

Modular x-ray measurement system

A method and system is presented in radiography for optimizing image quality of an object (e.g. an anatomical region of a patient), while minimizing the radiation dose to the patient. X-ray exposure parameters, such as operating voltage (kVp), operating current (mA), focal spot size, and soft x-ray filter combination, are dynamically controlled during the x-ray exposure. During at least two different sampling intervals and at two different kVp levels, x-rays are passed through the object, and detected by sensors located between the object and the image plane. After the last sampling interval, the sensor output signals and the measured thickness of the object are used to evaluate the optimal settings for the x-ray exposure parameters. The x-ray exposure parameters are set to these optimal settings for the remainder of the exposure period.

Growing community of inventors

Gloucester, MA, United States of America

Ruvin Deych