Saifun Semiconductors Ltd.

Stmicroelectronics S.r.l.

Spansion Israel Ltd

Rustom Irani

Boaz Eitan

Ilan Bloom

Assaf Shappir

Eli Lusky

Amichai Givant

Paolo Caprara

Claudio Brambilla

Sergio Manlio Cereda

Pierantonio Pozzoni

A method for creating a non-volatile memory array includes implanting pocket implants in a substrate at least between mask columns of a given width and at least through an ONO layer covering the substrate, generating increased-width polysilicon columns from the mask columns, generating bit lines in the substrate at least between the increased-width polysilicon columns and depositing oxide at least between the polysilicon columns.

Non-volatile memory structure and method of fabrication

Silicon trench isolation (STI) is formed between adjacent diffusions in a semiconductor device, such as between bitlines in a memory array. The STI may be self-aligned to the diffusions, and may prevent misaligned bitline (BL) contacts from contacting silicon outside of the corresponding bitlines. The bitline contacts may have sufficient overlap of the bitlines to ensure full coverage by the bitlines. Bitline oxides formed over buried bitlines may be used to self-align trenches of the STI to the bitlines. The STI trenches may be lined with a CMOS spacer, salicide blocking layer and/or a contact etch stop layer. STI may be formed after Poly-2 etch or after word line salicidation. The memory cells may be NVM devices such as NROM, SONOS, SANOS, MANOS, TANOS or Floating Gate (FG) devices.

Forming silicon trench isolation (STI) in semiconductor devices self-aligned to diffusion

A non-volatile memory array has word lines spaced a sub-F (sub-minimum feature size F) width apart and bit lines generally perpendicular to the word lines. The present invention also includes a method for word-line patterning of a non-volatile memory array which includes generating sub-F word lines from mask generated elements with widths of at least a minimum feature size F.

Dense non-volatile memory array and method of fabrication

A non-volatile memory array includes a multiplicity of memory cells, each of whose area is less than 4 Fper cell (where F is a minimum feature size), and periphery elements to control the memory cells. The present invention also includes a non-volatile memory array which includes word lines and bit lines generally perpendicular to the word lines, with a word line pitch of less than 2 F. In one embodiment, the word lines are made of polysilicon spacers.

An NVM cell such as an NROM cell is formed using a portion of one ONO stack and an adjacent portion of a neighboring NROM stack. A gate structure is formed between (and atop) the two ONO portions, or 'strips' (or 'stripes'). This provides having two physically separated charge storage regions (nitride &#x201c;strips&#x201d;, or &#x201c;stripes&#x201d;) in each memory cell.

Double density NROM with nitride strips (DDNS)

A process for manufacturing electronic semiconductor integrated electronic memory devices having virtual ground and including at least a matrix of floating gate memory cells formed on a semiconductor substrate with a plurality of continuous bit lines extending across the substrate as discrete parallel strips begins with forming an oxide layer over the matrix region. Then, the semiconductor throughout is deposited with a stack structure which includes a first conductor layer, a first dielectric layer, and second conductor layer. Next, a second dielectric layer is formed. Floating gate regions are defined by photolithography using a mask of &ldquo;POLY,along a first predetermined direction&rdquo;, and associated etching, to define, in the stack structure, a plurality of parallel openings. These openings are implanted to confer a predetermined conductivity on the bit line regions. Next, the parallel openings are filled with a photo-sensitive material to protect the matrix bit lines.

Growing community of inventors

Santa Clara, CA, United States of America

Rustom Irani