Vtc Inc.

Russell V Solstad

Millard Scott

William Holliday

The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar base is adhered to the surface of the chip having the electrical pads. The leads are then bent over the base to secure the base on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure. At a desired time, the complete chip packaging structure may be removed from the tape by cutting the frame.

Integrated circuit packaging process and structure

An apparatus for electrically and thermally 'burning in' a plurality of integrated circuits mounted on a carrier tape includes a printed circuit board base and a cover. The printed circuit board base includes a plurality of contact arrays arranged and constructed to contact the leads from the integrated cirucits mounted on the tape. The cover is pivotally connected to the printed circuit board base and includes a corresponding number of pressure pads which force contact between integrated circuit leads and a contact array when the cover is in its closed position. A locking assembly is provided to keep the cover locked in its closed position. The printed circuit board base also carries circuitry for electrically exercising the integrated circuits during burn-in.

Burn-in apparatus for integrated circuits mounted on a carrier tape

An apparatus for electrically and thermally 'burning in' a plurality of integrated circuits mounted on a carrier tape includes a printed circuit board base and a pair of covers. The printed circuit board base includes a plurality of contact arrays arranged and constructed to contact the leads from the integrated circuits mounted on the tape. The pair of covers are pivotally connected to the printed circuit board base. The covers include a corresponding number of pressure pads which force contact between integrated circuit leads and a contact array when a cover is in its closed position. A locking assembly is provided to keep the covers locked in their closed positions. The printed circuit board base also carries circuitry for electrically exercising the integrated circuits during burn-in.

The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar base is adehered to the surface of the chip having the electrical pads. The leads are then bent over the base to secure the base on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure. At a desired time, the complete chip packaging structure may be removed from the tape by cutting the frame.

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Saint Paul, MN, United States of America

Russell V Solstad